H01L2224/797 - CPC Classification Index

ClassID:

210717 ⎘

H01L2224/797 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB] Means for aligning

Sub-classes:

H01L2224/79701 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
H01L2224/79702 » in the upper part of the bonding apparatus, e.g. in the pressing head 0
H01L2224/79703 » Mechanical holding means 1
H01L2224/79723 » Electrostatic holding means 0
H01L2224/79733 » Magnetic holding means 0
H01L2224/79743 » Suction holding means 0
H01L2224/79753 » Means for optical alignment, e.g. sensors 2
H01L2224/79754 » Guiding structures 0