H01L2224/79703 - CPC Classification Index

ClassID:

210720 ⎘

H01L2224/79703 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for aligning Mechanical holding means

Sub-classes:

H01L2224/79704 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
H01L2224/79705 » in the upper part of the bonding apparatus, e.g. in the pressing head 0

Recent Application in this class:

20190160488

2019-05-30

Electrically conductive pattern printer for downhole tools