H01L2224/79981 - CPC Classification Index

ClassID:

210754 ⎘

H01L2224/79981 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB] Apparatus chuck

Sub-classes:

H01L2224/79982 » Shape 0
H01L2224/79985 » Material 1
H01L2224/79986 » Auxiliary members on the pressing surface 0