H01L2224/79986 - CPC Classification Index

ClassID:

210759 ⎘

H01L2224/79986 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Apparatus chuck Auxiliary members on the pressing surface

Sub-classes:

H01L2224/79987 » Shape of the auxiliary member 0
H01L2224/79988 » Material of the auxiliary member 1