210882 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques; Soldering or alloying Diffusion bonding
Sub-classes:IMAGE SENSOR HAVING A STACK STRUCTURE OF SUBSTRATES
#2CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND DIFFUSION SOLDERING
#3SEMICONDUCTOR PACKAGE
#4GANG-FLIPPING OF DIES PRIOR TO BONDING
#5IMAGE SENSOR
#6Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#7Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#8Semiconductor device and method for manufacturing a semiconductor device
#9Bonded structure with enhanced adhesion strength
#10Method for bonding of chips on wafers
#11Encapsulated semiconductor chip with external contact pads and manufacturing method thereof
#12Bonded structure with enhanced adhesion strength
#13Self-aligned through vias for chip stacking