H01L2224/8085 - CPC Classification Index

ClassID:

210886 ⎘

H01L2224/8085 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester

Sub-classes:

H01L2224/80855 » Hardening the adhesive by curing, i.e. thermosetting 10
H01L2224/8088 » Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives 1
H01L2224/80885 » Combinations of two or more hardening methods provided for in at least two different groups from to , e.g. for hybrid thermoplastic-thermosetting adhesives 1

Recent Application in this class:

20250357457

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

20230420437

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

20230064032

EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS

20210398939

Display device and method for manufacturing the same

20210225800

Bonding apparatus incorporating variable force distribution

20190027676

Electronic module with sealing resin

20180301609

Using MEMS fabrication incorporating into LED device mounting and assembly

20160155862

Methods of manufacturing a semiconductor device

20160099393

Using MEMS fabrication incorporating into LED device mounting and assembly

20150348935

Method of Temporarily Attaching a Rigid Carrier to a Substrate

20150255411

DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS

20150212340

Assembly bonding

20150115458

Semiconductor device and method for manufacturing a semiconductor device

20150111317

Method of manufacturing semiconductor device

20150084170

Semiconductor package and method of fabricating the same

20120171481

Optically clear adhesive for dicing die bonding film

20100297829

Method of Temporarily Attaching a Rigid Carrier to a Substrate

20100071946

Electronic component mounting structure