210887 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester Hardening the adhesive by curing, i.e. thermosetting
Sub-classes:LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
#2HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS ON BOTH SIDES OF THE DIE
#3Low cost three-dimensional stacking semiconductor assemblies
#4Low cost three-dimensional stacking semiconductor assemblies
#5Hybrid bonding with through substrate via (TSV)
#6Method for forming hybrid bonding with through substrate via (TSV)
#7Hybrid bonding with through substrate via (TSV)
#8Optically clear adhesive for dicing die bonding film
#9Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate
#10Semiconductor device and method for manufacturing the same