210903 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
Sub-classes:INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#2STACKED SEMICONDUCTOR DEVICE
#3INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#4Stacked semiconductor device
#5Integration and bonding of micro-devices into system substrate
#6Stacked semiconductor device
#7Integration and bonding of micro-devices into system substrate
#8Stacked semiconductor device
#9Power semiconductor package device having locking mechanism, and preparation method thereof
#10Stacked semiconductor device
#11Stacked semiconductor device
#12DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS
#13Stacked semiconductor device