210904 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques; Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
Sub-classes:Methods of achieving universal interfacing using suspended and/or freestanding structures
#2Small footprint semiconductor package
#3Apparatus and method for packaging circuits
#4Apparatus and method for packaging circuits
#5Method for fabricating packaged die
#6Apparatus and method for packaging circuits