210936 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
Sub-classes:ELECTRONIC DEVICE
#2SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES
#3SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
#4COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
#5MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
#6Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die
#7Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features
#8Multi-chip package and method of providing die-to-die interconnects in same
#9PACKAGE WITH FAN-OUT STRUCTURES
#10SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES
#11Semiconductor device package and manufacturing method thereof
#12Multi-chip package and method of providing die-to-die interconnects in same
#13Package with fan-out structures
#14Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die
#15Multi-chip package and method of providing die-to-die interconnects in same
#16Multi-chip package and method of providing die-to-die interconnects in same
#17Semiconductor device package and manufacturing method thereof
#18Semiconductor device with redistribution layers formed utilizing dummy substrates
#19EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
#20Package with thinned substrate
#21Multi-chip package and method of providing die-to-die interconnects in same
#22Method for manufacturing semiconductor package having redistribution layer
#23Semiconductor device package and manufacturing method thereof
#24Semiconductor device having stacked semiconductor chips and method for fabricating the same
#25Semiconductor package having reduced internal power pad pitch
#26Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
#27Semiconductor device including a re-interconnection layer and method for manufacturing same
#28Methods of fabricating semiconductor packages including reinforcement top die
#29Folded semiconductor package architectures and methods of assembling same
#30Package with fan-out structures
#31Light emitting device and method of forming the same
#32Assembly of semiconductor devices using multiple LED placement cycles
#33Method of making a light emitting diode array on a backplane
#34Package with thinned substrate
#35Embedded-bridge substrate connectors and methods of assembling same
#36Releasable carrier method
#37Removable sacrificial connections for semiconductor devices
#38Picking up irregular semiconductor chips
#39Laser lift-off on isolated III-nitride light islands for inter-substrate LED transfer
#40Multi-chip package and method of providing die-to-die interconnects in same
#41Substrateless integrated circuit packages and methods of forming same
#42Semiconductor device and method of forming interposer with opening to contain semiconductor die
#43Tooling for coupling multiple electronic chips
#44Light emitting diode array on a backplane and method of making thereof
#45Removable sacrificial connections for semiconductor devices
#463D semiconductor device and system
#47Light-emitting device
#48Laser lift-off on isolated III-nitride light islands for inter-substrate LED transfer
#49Resin-encapsulatd semiconductor device and method of manufacturing the same
#50Releasable carrier and method
#51Encapsulated electronics
#52Fixture to constrain laminate and method of assembly
#53Reliable device assembly
#54Tooling for coupling multiple electronic chips
#55Semiconductor system and device
#56Substrateless integrated circuit packages and methods of forming same
#57Apparatus and methods for high-density chip connectivity
#58Methods for high precision microelectronic die integration
#59Light-emitting device
#60Semiconductor device with redistribution layers formed utilizing dummy substrates
#61Semiconductor device and manufacturing method thereof
#62Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#63Dam structure for enhancing joint yield in bonding processes
#64Method of forming a reliable microelectronic assembly
#65Semiconductor device with overlapped lead terminals
#66Methods for high precision microelectronic die integration
#67Fixture to constrain laminate and method of assembly
#68Method and system for a semiconductor for device package with a die-to-packaging substrate first bond
#69Semiconductor device and semiconductor assembly with lead-free solder
#70Method for manufacturing semiconductor device
#71Bump structure for stacked dies
#72Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#73SYSTEM IN PACKAGE MODULE ASSEMBLY
#74Wiring board and semiconductor device
#75Protection layer for adhesive material at wafer edge
#76Chip assembly with a coreless substrate employing a patterned adhesive layer
#77Packaging process tools and systems, and packaging methods for semiconductor devices
#78Packaging process tools and packaging methods for semiconductor devices
#79Method for producing chip stacks, and a carrier for carrying out the method
#80Semiconductor system and device
#81Method for producing a wafer provided with chips
#82Methods of forming semiconductor modules including flexible panels
#83Flexible electronic device and method for the fabrication of same
#84Protection layer for adhesive material at wafer edge
#85Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
#86Multi-chip package and method of providing die-to-die interconnects in same
#87Fixture to constrain laminate and method of assembly
#88Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#89Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#90Bonding apparatus and bonding method
#91Bonding apparatus
#92Fixture to constrain laminate and method of assembly
#93Integrated circuit device and method for manufacturing integrated circuit device
#94Apparatus and methods for high-density chip connectivity
#95Chip assembly with a coreless substrate employing a patterned adhesive layer
#96Stretchable electronic device
#97Electronic packaging apparatus and electronic packaging method
#98Semiconductor device and manufacturing method thereof
#99Method of fabricating wiring board and method of fabricating semiconductor device
#100PATTERNED CONTACT
#101Inverse chip connector
#102Sacrificial material to facilitate thin die attach
#103Pin-type chip tooling
#104Ferroelectric component and manufacturing the same
#105Rigid-backed, membrane-based chip tooling
#1063D IC architecture with interposer and interconnect structure for bonding dies
#107Semiconductor device and semiconductor assembly with lead-free solder
#108Dual carrier for joining IC die or wafers to TSV wafers
#109Method of manufacturing stacked semiconductor package
#110Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
#111Method for manufacturing semiconductor device
#112Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture
#113Contact-based encapsulation
#114Semiconductor device and manufacturing method thereof
#115Method for manufacturing lamination type semiconductor integrated device
#116Wiring circuit structure and manufacturing method for semiconductor device using the structure
#117Semiconductor device and manufacturing method thereof
#118Surface modification for handling wafer thinning process
#119Flip chip interconnection with double post
#120Semiconductor device with overlapped lead terminals
#121Integrated circuit device and method for manufacturing integrated circuit device
#122Assembly of multi-chip modules using sacrificial features
#123Semiconductor device and method of forming interposer with opening to contain semiconductor die
#124LOW COST DIE PLACEMENT
#125Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#126Protection layer for adhesive material at wafer edge
#127Electro-optic apparatus, electronic device, and method for manufacturing electro-optic apparatus
#128Integrated circuit packaging system with through silicon via base and method of manufacture thereof
#129Self-aligned wafer bonding
#130Multi-chip package and method of providing die-to-die interconnects in same
#131INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF
#132Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#133Wafer backside structures having copper pillars
#134Method of handling a thin wafer
#135Chip stack package and method of fabricating the same
#136Coaxial through chip connection
#137Method of Producing Optoelectronic Components and Optoelectronic Component
#138Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips
#139Method of forming bump structure having tapered sidewalls for stacked dies
#140WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
#141Low cost die placement
#142LOW COST FLEXIBLE DISPLAY SHEET
#143Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
#144Semiconductor chip and semiconductor device
#145Semiconductor device and manufacturing method thereof
#146Wafer Leveling-Bonding System Using Disposable Foils
#147Semiconductor device including a pressure-contact section
#148Manufacturing method of semiconductor device
#149Flip chip interconnection with double post
#150Integrated circuit device and method for manufacturing integrated circuit device
#151MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
#152Method for micro component self-assembly
#153High-Density Fine Line Structure And Method Of Manufacturing The Same
#154Image display unit with light emitting devices having a resin surrounding the light emitting devices
#155Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer
#156Process for making microelectronic element chips
#157Semiconductor device and manufacturing method for the same
#158Mounting method
#159Substrate removal during LED formation
#160High-density fine line structure and method of manufacturing the same
#161Stack circuit member and method
#162GANG FLIPPING FOR FLIP-CHIP PACKAGING
#163Electronic part mounting board and method of mounting the same
#164Semiconductor device and manufacturing method thereof
#165Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier
#166Method for precision assembly of integrated circuit chip packages
#167Laminated memory
#168Assembly of thin die coreless package
#169Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
#170Probe arrays and method for making
#171METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER
#172Semiconductor device and method of manufacturing the semiconductor device
#173Microelectronic element chips
#174INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#175Method for precision assembly of integrated circuit chip packages
#176PACKAGE WARPAGE CONTROL
#177Method for manufacturing semiconductor device
#178Facility and method for high-performance circuit board connection
#179Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
#180CHIP CONNECTOR
#181Tooling for coupling multiple electronic chips
#182Semiconductor device
#183PACKAGE WARPAGE CONTROL
#184SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#185Coaxial through chip connection
#186Pin-type chip tooling
#187Method of manufacturing a semiconductor device
#188Electronic-part built-in substrate and manufacturing method therefor
#189Electro-optical device, transferred chip, and transfer origin substrate
#190Method of producing image display unit
#191Semiconductor package having an interfacial adhesive layer
#192Method of manufacturing wiring board
#193IC chip mounting method
#194Coaxial through chip connection
#195Post-attachment chip-to-chip connection
#196Rigid-backed, membrane-based chip tooling
#197Through chip connection
#198Integrated electronic chip and interconnect device and process for making the same
#199Inverse chip connector
#200Chip connector
#201Stack circuit member and method
#202Profiled contact
#203Patterned contact
#204Contact-based encapsulation
#205Membrane-based chip tooling
#206Integrated circuit device and method for manufacturing integrated circuit device
#207Method of fabricating wiring board and method of fabricating semiconductor device
#208Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#209Methods of vertically stacking wafers using porous silicon
#210Method and system for performing die attach using a flame
#211Probe arrays and method for making
#212Electronic component comprising external surface contacts and a method for producing the same
#213Wafer-level assembly method for semiconductor devices
#214Taped lead frames and methods of making and using the same in semiconductor packaging
#215Semiconductor, electrooptic apparatus and electronic apparatus
#216Package warpage control
#217Flipchip QFN package
#218Method of manufacturing a semiconductor device
#219Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#220INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#221Method of fabricating integrated electronic chip with an interconnect device