H01L2224/8101 - CPC Classification Index

ClassID:

210941 ⎘

H01L2224/8101 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area Cleaning the bump connector, e.g. oxide removal step, desmearing

Sub-classes:

H01L2224/81011 » Chemical cleaning, e.g. etching, flux 266
H01L2224/81012 » Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow 19
H01L2224/81013 » Plasma cleaning 60
H01L2224/81014 » Thermal cleaning, e.g. decomposition, sublimation 12
H01L2224/81019 » Combinations of two or more cleaning methods provided for in at least two different groups from to 1

Recent Application in this class:

20210081636

Fingerprint sensor device and method

20200303365

Contoured package-on-package joint

20200117874

Fingerprint sensor device and method

20190326190

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

20190251321

Fingerprint sensor device and method

20180261587

Contoured package-on-package joint

20180150667

Fingerprint sensor device and method

20170358554

Wafer stacking for integrated circuit manufacturing

20170249493

Fingerprint sensor device and method

20170125374

Rework process and tool design for semiconductor package

20170092614

Semiconductor device and manufacturing method therefor

20160197067

Contoured package-on-package joint

20150048523

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

20140342504

Method of manufacturing an electronic device, and electronic device manufacturing apparatus

20140332955

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

20140124937

Contoured package-on-package joint

20140037923

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

20130187293

Electronic device having electrodes bonded with each other

20120285923

System and method for removing oxide from a sensor clip assembly

20120261808

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

20120098126

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

20120074588

Integrated circuit packaging system with warpage control and method of manufacture thereof

20120028418

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

20110254153

Die structure and die connecting method

20110156279

Film for flip chip type semiconductor back surface

20110156278

Film for flip chip type semiconductor back surface

20110140251

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

20110045653

Bonding method and bonding apparatus

20100011572

Electronic component assembly

20090108443

Flip-Chip Interconnect Structure

20090008776

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

20080203138

Method of mounting an electronic component and mounting apparatus

20070105459

Joining method and joining device

20060220258

Method for mounting semiconductor chips on a substrate and corresponding assembly