210945 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area; Cleaning the bump connector, e.g. oxide removal step, desmearing Thermal cleaning, e.g. decomposition, sublimation
ROOM TEMPERATURE METAL DIRECT BONDING
#2Method for producing semiconductor chip
#3Method for producing semiconductor package
#4Room temperature metal direct bonding
#5Room temperature metal direct bonding
#6Method of manufacturing an electronic device, and electronic device manufacturing apparatus
#7Bonding structure manufacturing method, heating and melting treatment method, and system therefor
#8Room temperature metal direct bonding
#9Electronic device having electrodes bonded with each other
#10Room temperature metal direct bonding
#11Room temperature metal direct bonding
#12Room temperature metal direct bonding