Patents-Review.com
ClassID:

210947 ⎘

H01L2224/8102 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area Applying permanent coating to the bump connector in the bonding apparatus, e.g. in-situ coating

Recent Application in this class:
#1
20250364471
2025-11-27

Semiconductor Device

 #2
20250096193
2025-03-20

METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO SUBSTRATES

 #3
20250087610
2025-03-13

ELECTRONIC CHIP WITH CONNECTING PILLARS FOR SINTERING ASSEMBLY

 #4
20220328448
2022-10-13

Manufacturing method of an electronic apparatus

 #5
20220148989
2022-05-12

Semiconductor packages

 #6
20220102603
2022-03-31

Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials

 #7
20210351156
2021-11-11

Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip

 #8
20210225802
2021-07-22

Method of manufacturing an electronic device and electronic device manufactured thereby

 #9
20200395332
2020-12-17

Package with conductive underfill ground plane

 #10
20200227378
2020-07-16

Method of manufacturing an electronic device and electronic device manufactured thereby

 #11
20190385974
2019-12-19

Flip-chip method

 #12
20190051629
2019-02-14

Method of manufacturing an electronic device and electronic device manufactured thereby

 #13
20170162535
2017-06-08

Transient interface gradient bonding for metal bonds

 #14
20170092631
2017-03-30

Interconnection structure, LED module and method

 #15
20170053858
2017-02-23

SUBSTRATE ON SUBSTRATE PACKAGE

 #16
20150311177
2015-10-29

Chip packaging method and chip package using hydrophobic surface

 #17
20150303167
2015-10-22

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND ELECTRONIC APPARATUS

 #18
20140342504
2014-11-20

Method of manufacturing an electronic device, and electronic device manufacturing apparatus

 #19
20140096379
2014-04-10

Electronic component mounting method

 #20
20130187293
2013-07-25

Electronic device having electrodes bonded with each other

 #21
20130043585
2013-02-21

Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus

 #22
20110068151
2011-03-24

Method of attaching a solder ball and method of repairing a memory module

 #23
20110039375
2011-02-17

Method of manufacturing semiconductor device

 #24
20100314433
2010-12-16

Method for manufacturing tight pitch, flip chip integrated circuit packages