210952 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area; Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector by chemical means, e.g. etching, anodisation
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH NANO-ROUGHENED INTERCONNECTS
#2Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip
#3Package on-package method
#4Method of manufacturing an electronic device, and electronic device manufacturing apparatus