H01L2224/8103 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector

• H01L2224/81031 » by chemical means, e.g. etching, anodisation 4
• H01L2224/81035 » by heating means 8
• H01L2224/81047 » by mechanical means, e.g. severing, pressing, stamping 16