METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSITIONING APPARATUS

Bonding of bridge to multiple semiconductor chips

Bonding of bridge to multiple semiconductor chips

Solder member mounting system

Semiconductor device having through parts of different shapes

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

Solder member mounting method and system

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

Ball grid array and land grid array assemblies fabricated using temporary resist

Chip bonding apparatus, chip bonding method and a chip package structure

ROOM TEMPERATURE METAL DIRECT BONDING

Methods of fluxless micro-piercing of solder balls, and resulting devices

Injection molded solder bumping

Tooling for coupling multiple electronic chips

Electronic device, electronic device fabrication method, and electronic apparatus

Chip attach frame

System and methods for producing modular stacked integrated circuits

Tooling for coupling multiple electronic chips

Semiconductor device and method of manufacturing same

Ball grid array and land grid array assemblies fabricated using temporary resist

Room temperature metal direct bonding

Semiconductor device and method of manufacturing same

Methods of fluxless micro-piercing of solder balls, and resulting devices

Semiconductor device and method of manufacturing same

Room temperature metal direct bonding

Packaging process tools and packaging methods for semiconductor devices

Semiconductor device and method of forming high routing density interconnect sites on substrate

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Method for housing an electronic component in a device package and an electronic component housed in the device package

SYSTEM IN PACKAGE MODULE ASSEMBLY

Room temperature metal direct bonding

Chip attach frame

Packaging process tools and systems, and packaging methods for semiconductor devices

Methods for performing reflow in bonding processes

Packaging process tools and packaging methods for semiconductor devices

Flip chip interconnection having narrow interconnection sites on the substrate

Method of manufacturing a circuit substrate

Method for fabricating multi-chip module with multi-level interposer

Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate

Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate

Semiconductor device, method of manufacturing semiconductor device, and electronic device

Electronic assemblies including mechanically secured protruding bonding conductor joints

Semiconductor device and method of manufacturing the same

Microelectronic packages with dual or multiple-etched flip-chip connectors

METHOD AND SYSTEM FOR ALIGNMENT OF INTEGRATED CIRCUITS

PATTERNED CONTACT

Inverse chip connector

Thru silicon enabled die stacking scheme

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Multi-chip module with multi-level interposer

Pin-type chip tooling

Rigid-backed, membrane-based chip tooling

Wafer-level packaged device having self-assembled resilient leads

Systems and Methods Providing Arrangements of Vias

Method of stacking flip-chip on wire-bonded chip

Solder Pillars in Flip Chip Assembly

Wiring board, semiconductor device and method for manufacturing the same

Contact-based encapsulation

Wiring circuit structure and manufacturing method for semiconductor device using the structure

Integrated-circuit package for proximity communication

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

Electronic assemblies including mechanically secured protruding bonding conductor joints

Flip chip interconnection with double post

Room temperature metal direct bonding

Self-assembly of chips on a substrate

Semiconductor devices having stress relief layers and methods for fabricating the same

Method for insertion bonding and device thus obtained

Packaged semiconductor chips

Method for aligning and bonding elements and a device comprising aligned and bonded elements

Flip-chip module and method for the production thereof

MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

3-D semiconductor die structure with containing feature and method

Thru silicon enabled die stacking scheme

Copper pillar bonding for fine pitch flip chip devices

Circuit substrate and method for utilizing packaging of the circuit substrate

CHIP PACKAGING METHOD

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Methods of fluxless micro-piercing of solder balls, and resulting devices

Electronic component

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

CHIP PACKAGE STRUCTURE

THRU SILICON ENABLED DIE STACKING SCHEME

Coaxial through chip connection

Flip chip interconnection having narrow interconnection sites on the substrate

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips

Semiconductor device and method of manufacturing the same

CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE CIRCUIT SUBSTRATE

Semiconductor chip bump connection apparatus and method

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Connection by fitting together two soldered inserts

Stacked Semiconductor Chips with Through Substrate Vias

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Method of packaging and interconnection of integrated circuits

Pixel interconnect insulators and methods thereof

Method for housing an electronic component in a device package and an electronic component housed in the device package

Semiconductor device and method of manufacturing the same

Method for fabricating a packaging substrate

WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING

Semiconductor chip bump connection apparatus and method

Display device and manufacturing method of the same

Chip-based thermo-stack

Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking

Integrated circuit packaging system with warpage control system and method of manufacture thereof

Semiconductor device and manufacturing method of semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF

Semiconductor device and method of manufacturing semiconductor device

Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby

3-D semiconductor die structure with containing feature and method

Method and system for providing an aligned semiconductor assembly

Methods of fluxless micro-piercing of solder balls, and resulting devices

Flip chip interconnection with double post

High-volume on-wafer heterogeneous packaging of optical interconnects

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

Method and system for providing a reliable semiconductor assembly

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Integrated-circuit package for proximity communication

Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor package

Flip-chip component production method

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method for the same

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

Self-aligned wafer or chip structure, and self-aligned stacked structure

Connected body and optical transceiver module

Method of assembling a silicon stack semiconductor package

Semiconductor package with under bump metallization aligned with open vias

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor package and fabricating method thereof

Bond quality indication by bump structure on substrate

Method for precision assembly of integrated circuit chip packages

FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE

Semiconductor chip assembly and fabrication method therefor

Articles and assembly for magnetically directed self assembly and methods of manufacture

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Packaged semiconductor chips

Probe arrays and method for making

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

Structure of mounting electronic component

Electric component with a flip-chip construction

Method for producing a module with components stacked one above another

Substrate and process for semiconductor flip chip package

Method and apparatus for precisely aligning integrated circuit chips

Method of manufacturing an integrated circuit

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Chip stack, method of fabrication thereof, and semiconductor package having the same

COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Process for bonding and electrically connecting microsystems integrated in several distinct substrates

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Devices with microjetted polymer standoffs

Room temperature metal direct bonding

Semiconductor device manufacturing method

Article and assembly for magnetically directed self assembly

Carbon nanotube via interconnect

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Method for precision assembly of integrated circuit chip packages

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Integrated circuit package system

Method for diffusion soldering

Flip-Chip Device Having Underfill in Controlled Gap

Apparatus and methods for high-density chip connectivity

CHIP CONNECTOR

Magnetic alignment of integrated circuits to each other

Tooling for coupling multiple electronic chips

Method for making flip chip on leadframe package

Integrated circuit package system

CIRCUIT SUBSTRATE AND PACKAGING THEREOF AND THE METHOD FOR FABRICATING THE PACKAGING

Back-to-front via process

GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

Methods including fluxless chip attach processes

Electrical connection methods employing corresponding, insulator-coated members of interconnection elements

Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components

Chip on a board

Coaxial through chip connection

Carbon nanotube reinforced metallic layer

Bonding structure with buffer layer and method of forming the same

Pin-type chip tooling

Integrated circuit package system with integrated circuit support

Printed circuit board, electronic device, and manufacturing method for printed circuit board

Semiconductor component and method for production of a semiconductor component

Method of producing image display unit

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Optical imaging device for optical proximity communication

Resonator system for optical proximity communication

Display device and manufacturing method of the same

Methods and apparatus for high-density chip connectivity

Method of packaging and interconnection of integrated circuits

Self alignment features for an electronic assembly

Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography

Method and structure for interfacing electronic devices

Method for mounting electronic element on a circuit board

Self alignment features for an electronic assembly

Substrate for manufacturing semiconductor device, semiconductor device manufacturing method

Chip and multi-chip semiconductor device using the chip, and method for manufacturing same

Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material

Flip chip packaging using recessed interposer terminals

Method of soldering or brazing articles having surfaces that are difficult to bond

Coaxial through chip connection

Post-attachment chip-to-chip connection

Rigid-backed, membrane-based chip tooling

Through chip connection

Chip-based thermo-stack

Integrated electronic chip and interconnect device and process for making the same

Inverse chip connector

Chip connector

Profiled contact

Patterned contact

Contact-based encapsulation

Membrane-based chip tooling

Growth of carbon nanotubes to join surfaces

Gap control between interposer and substrate in electronic assemblies

Method for fabricating a flip chip package

Flip chip interconnection having narrow interconnection sites on the substrate

System and method to increase die stand-off height

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

Semiconductor flip chip package having substantially non-collapsible spacer

Method of manufacturing an electronic device

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

Contact structure and method for manufacturing the same

Semiconductor device and process for producing the same

Structure and manufacturing method of a chip scale package

Methods relating to forming interconnects

Electronic device including a substrate structure and a process for forming the same

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

RFID tag and method of manufacturing the same

RFID tag and method of manufacturing the same

Flip chip package with anti-floating structure

Fabricating stacked chips using fluidic templated-assembly

Die-to-die connection method and assemblies and packages including dice so connected

Substrate package structure and packaging method thereof

Probe arrays and method for making

Socket grid array

Structure of mounting electronic component

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Method for manufacturing electronic component-mounted board

Methods of making microelectronic assemblies including compliant interfaces

Collars, support structures, and forms for protruding conductive structures

Method and structure for manufacturing improved yield semiconductor packaged devices

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Underfill and encapsulation of semiconductor assemblies with materials having differing properties

Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

Fine-pitch packaging substrate and a method of forming the same

Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface

Display device and manufacturing method of the same

Circuit board, device mounting structure, device mounting method, and electronic apparatus

Methods for forming electrical connections and resulting devices

Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof

Semiconductor component assemblies having interconnects

Method and structure for interfacing electronic devices

Socket grid array

Chip and multi-chip semiconductor device using thereof and method for manufacturing same

Room temperature metal direct bonding

Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale

Semiconductor chip package

Methods of making microelectronic assemblies including compliant interfaces

Bonding structure with buffer layer and method of forming the same

Semiconductor device

Bonding structure with compliant bumps

Printed circuit board unit with detachment mechanism for electronic component

Methods relating to forming interconnects and resulting assemblies

Electrical circuit assembly with improved shock resistance

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Heat dissipation apparatus for package device

Electronic component-built-in module

Reconnectable chip interface and chip package

Reconnectable chip interface and chip package

Injection molded solder bumping