210989 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
Sub-classes:METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT
#2Optical-electrical interposers
#3Methods of fluxless micro-piercing of solder balls, and resulting devices
#4Conductive connections, structures with such connections, and methods of manufacture
#5Hybrid felts of electrospun nanofibers
#6Conductive connections, structures with such connections, and methods of manufacture
#7Hybrid felts of electrospun nanofibers
#8Conductive connections, structures with such connections, and methods of manufacture
#9Conductive connections, structures with such connections, and methods of manufacture
#10Thin wafer handling and known good die test method
#11Methods of fluxless micro-piercing of solder balls, and resulting devices
#12Maintaining alignment in a multi-chip module using a compressible structure
#13Interconnection and assembly of three-dimensional chip packages
#14Method for fabricating multi-chip module with multi-level interposer
#15ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING CIRCUIT BOARD ASSEMBLY
#16Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
#17Scalable transfer-join bonding lock-and-key structures
#18Multi-chip module with multi-level interposer
#19Methods of fluxless micro-piercing of solder balls, and resulting devices
#20Electrical Component
#21Method and apparatus for facilitating proximity communication and power delivery
#22Methods of fluxless micro-piercing of solder balls, and resulting devices
#23WAFER SCALE THIN FILM PACKAGE
#24Method and apparatus for precisely aligning integrated circuit chips
#25Integrated circuit package system with integrated circuit support
#26Semiconductor component and method for production of a semiconductor component
#27Method and apparatus for facilitating proximity communication and power delivery
#28Electronic assembly with controlled solder joint thickness
#29Expansion constrained die stack