211081 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding techniques; Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
Sub-classes:PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
#2Substrate bonding method
#3Supporting backplane, manufacturing method therefor and backplane
#4Display device and method of providing the same
#5Flexible electronic structure
#6Flexible electronic structure including a support element
#7METHOD OF FABRICATING A CONDUCTIVE LAYER ON AN IC USING NON-LITHOGRAPHIC FABRICATION TECHNIQUES
#8Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#9Method for the electrical bonding of semiconductor components
#10Package structure and bonding method thereof
#11Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#12Electronic module and method for producing same
#13CHIP BONDING PROCESS
#14Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#15Micro-scrub process for fluxless micro-bump bonding
#16Bonding structure for semiconductor package and method of manufacturing the same
#17Semiconductor device and method for manufacturing the semiconductor device
#18Semiconductor device and method of manufacturing same
#19Stack packages and methods of fabricating the same
#20Contact bump connection and contact bump and method for producing a contact bump connection
#21Technique for controlling positions of stacked dies
#22Stack packages and methods of fabricating the same
#23Semiconductor device and method for manufacturing the semiconductor device
#24Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#25Contact bumps methods of making contact bumps
#26Method for thin die-to-wafer bonding
#27Electronic assemblies including mechanically secured protruding bonding conductor joints
#28Semiconductor device and method of manufacturing the same
#29Stress reduction in chip packaging by using a low-temperature chip-package connection regime
#30Multilevel interconnection system
#31Recessed pillar structure
#32Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#33Electronic assemblies including mechanically secured protruding bonding conductor joints
#34Method for bonding two electronic components
#35Semiconductor device and method of manufacturing the same
#36Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#37Conductive nanowires for electrical interconnect
#38Semiconductor device including a pressure-contact section
#39Apparatus incorporating small-feature-size and large-feature-size components and method for making same
#40Semiconductor device and method of manufacturing thereof
#41Semiconductor device and method of manufacturing thereof
#42Method of making a compliant interconnect assembly
#43Compliant interconnect assembly
#44Compliant interconnect assembly
#45Reconnectable chip interface and chip package
#46Reconnectable chip interface and chip package
#47Advanced metal-to-metal direct bonding
#48Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof