211082 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding techniques; Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like; Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other using resilient parts in the bump connector or in the bonding area
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
#2Connecting elements for producing hybrid electronic circuits
#3Metallurgical clamshell methods for micro land grid array fabrication
#4Interconnection and assembly of three-dimensional chip packages
#5SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME
#6Metallurgical clamshell methods for micro land grid array fabrication
#7Semiconductor package and method of manufacturing the same
#8Semiconductor package and method of manufacturing the same
#9Flexible joint methodology to attach a die on an organic substrate
#10Interconnect structure of an integrated circuit and manufacturing method thereof
#11Electronic function part mounted body and method of manufacturing the electronic function part mounted body
#12Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module
#13System for testing semiconductor components having interconnect with variable flexure contacts
#14Semiconductor test interconnect with variable flexure contacts having polymer material
#15Stud bump socket
#16Resin substrate
#17Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip