H01L2224/81909 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector Post-treatment of the bump connector or bonding area

• H01L2224/8191 » Cleaning, e.g. oxide removal step, desmearing 85
• H01L2224/8192 » Applying permanent coating, e.g. protective coating 75
• H01L2224/8193 » Reshaping 5
• H01L2224/81948 » Thermal treatments, e.g. annealing, controlled cooling 59
• H01L2224/81951 » Forming additional members, e.g. for reinforcing 16

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