H01L2224/8193 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Post-treatment of the bump connector or bonding area Reshaping

• H01L2224/81931 » by chemical means, e.g. etching 13
• H01L2224/81935 » by heating means, e.g. reflowing 9
• H01L2224/81947 » by mechanical means, e.g. ?pull-and-cut?, pressing, stamping 11

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