211109 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Post-treatment of the bump connector or bonding area Thermal treatments, e.g. annealing, controlled cooling
UTILIZING FORMATE SHELLS FOR METAL STRUCTURES ON INTEGRATED CIRCUIT COMPONENTS
#2SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#3LOW PRESSURE SINTERING POWDER
#4Substrate bonding method
#53D INTEGRATED CIRCUIT (3DIC) STRUCTURE
#6DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING THE SAME
#7SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
#83D INTEGRATED CIRCUIT (3DIC) STRUCTURE
#9Solderless interconnection structure and method of forming same
#10Low pressure sintering powder
#11Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
#12Module and method of manufacturing module
#13Method for manufacturing electronic package
#14Copper electroplating compositions and methods of electroplating copper on substrates
#15Semiconductor device and method of manufacturing thereof
#163D integrated circuit (3DIC) structure
#17Solderless interconnection structure and method of forming same
#18Solder reflow apparatus and method of manufacturing an electronic device
#19Copper electroplating compositions and methods of electroplating copper on substrates
#203D packaging method for semiconductor components
#21Enhanced cleaning for water-soluble flux soldering
#22Enhanced cleaning for water-soluble flux soldering
#23Thermocompression bonding systems and methods of operating the same
#24Multi-strike process for bonding packages and the packages thereof
#25Solder bumps formed on wafers using preformed solder balls with different compositions and sizes
#26Photodetector-arrays and methods of fabrication thereof
#27Sintering materials and attachment methods using same
#28Solderless interconnection structure and method of forming same
#29Electronic apparatus and method for fabricating the same
#30Semiconductor device and method of manufacturing thereof
#31Low pressure sintering powder
#32Electronic apparatus and method for fabricating the same
#33PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION
#34Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
#35Electronic apparatus and method for fabricating the same
#36Thermal compression bonding process cooling manifold
#37Bonded 3D integrated circuit (3DIC) structure
#38Electrical apparatus
#39Apparatus and method for manufacturing semiconductor device
#40Flip chip bonder and flip chip bonding method
#41Thermocompression bonding systems and methods of operating the same
#42Flip-chip hybridisation of two microelectronic components using a UV anneal
#43Electronic apparatus and method for fabricating the same
#44Bonding method, bonding apparatus, and method for manufacturing substrate
#453D assembly for interposer bow
#46Method for bonding semiconductor substrates and devices obtained thereof
#47Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
#48Package structure and substrate bonding method
#49Integrated Reflow and Cleaning Process and Apparatus for Performing the Same
#50Semiconductor apparatus
#51Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
#52Semiconductor apparatus including a metal alloy between a first contact and a second contact
#53Semiconductor device and assembling method thereof
#54Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime
#55Alignment structures for integrated-circuit packaging
#56Flux-free chip to wafer joint serial thermal processor arrangement
#57Solder Interconnect
#58Methods for bonding and micro-electronic devices produced according to such methods
#59Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
#60Intermetallic solder with low melting point
#61Methods for bonding and micro-electronic devices produced according to such methods