211101 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Post-treatment of the bump connector or bonding area; Reshaping by chemical means, e.g. etching
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#33D IC method and device
#43D IC method and device
#53D IC method and device
#63D IC method and device
#73D IC method and device
#8Semiconductor device, electronic device, and semiconductor device manufacturing method
#93D IC method and device
#10Semiconductor device, electronic device, and semiconductor device manufacturing method
#11Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits
#123D IC method and device
#133D IC method and device