211102 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Post-treatment of the bump connector or bonding area; Reshaping by heating means, e.g. reflowing
Sub-classes:MICROELECTRONIC DEVICE PACKAGE WITH INTEGRATED PASSIVE COMPONENT DIE AND SEMICONDUCTOR DEVICE DIE
#2SEMICONDUCTOR PACKAGE INCLUDING SOLDER STRUCTURE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
#3SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4SEMICONDUCTOR PACKAGE AND METHOD
#5SEMICONDUCTOR PACKAGE AND METHOD
#6CONNECTING STRUCTURE
#7SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
#8METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DEVICE
#9SELF-HEALING SOLDER INTERCONNECTION
#10PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
#11Semiconductor package and manufacturing method thereof
#12Mounting structure and method for manufacturing same
#13Semiconductor chip mounted on a packaging substrate
#14Mounting structure and method for manufacturing same
#15Semiconductor device manufacturing method and semiconductor device
#16METHOD OF INTERCONNECTING CHIPS USING CAPILLARY MOTION
#17Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor
#18Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor