H01L2224/81947 - CPC Classification Index

ClassID:

211108 ⎘

H01L2224/81947 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Post-treatment of the bump connector or bonding area; Reshaping by mechanical means, e.g. "pull-and-cut", pressing, stamping

Recent Application in this class:

20250167168

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMING THE SAME

20230268316

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

20230230962

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

20220157785

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

20200118913

Module and method of manufacturing module

20190295989

3D integrated circuit (3DIC) structure

20170012019

Solder bump stretching method for forming a solder bump joint in a device

20160351522

PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION

20160197055

Bonded 3D integrated circuit (3DIC) structure

20120211878

Chip package with plank stack of semiconductor dies

20120021183

Forming low stress joints using thermal compress bonding

20120018494

Thermal compress bonding