211119 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Pre-treatment of the connector or the bonding area Reshaping, e.g. forming vias
Sub-classes:3DIC Interconnect Apparatus and Method
#2SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#3STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
#43DIC Interconnect Apparatus and Method
#5Method for interconnecting stacked semiconductor devices
#6Wafer scale bonded active photonics interposer
#7Semiconductor device manufacturing method and semiconductor device
#8Semiconductor package and manufacturing method thereof
#9System on integrated chips and methods of forming same
#10Method of embedding low-k materials in antennas
#11Method for interconnecting stacked semiconductor devices
#12Interconnect structure for stacked device
#13Method for interconnecting stacked semiconductor devices
#14Semiconductor package and method of manufacturing a semiconductor package
#15Semiconductor package and manufacturing method thereof
#16Wafer scale bonded active photonics interposer
#17Method for contacting and rewiring an electronic component embedded into a printed circuit board
#18System on integrated chips and methods of forming same
#19Electronics package with integrated interconnect structure and method of manufacturing thereof
#20Semiconductor package and method of manufacturing a semiconductor package
#21Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas
#22Semiconductor structure and manufacturing method of the same
#23Metallic layer as carrier for component embedded in cavity of component carrier
#24Method for fabricating package structure
#25Semiconductor device, manufacturing method thereof, and electronic apparatus
#26Interconnect structure for stacked device
#27System on integrated chips and methods of forming same
#283DIC interconnect apparatus and method
#29Method for manufacturing a printed circuit board including an embedded electronic component
#30Semiconductor package and manufacturing method thereof
#31Method for interconnecting stacked semiconductor devices
#32Fan-out semiconductor package
#33Semiconductor device, manufacturing method thereof, and electronic apparatus
#34Manufacuting method of semiconductor structure
#35Semiconductor structure and manufacuting method of the same
#36Chip packaging method and chip packaging structure
#37Semiconductor device, manufacturing method thereof, and electronic apparatus
#38Power overlay structure and reconstituted semiconductor wafer having wirebonds
#39Embedding thin chips in polymer
#40Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
#41Semiconductor package and manufacturing method thereof
#42Semiconductor device and method of manufacturing semiconductor device
#43Method of fabricating a semiconductor device and the semiconductor device
#44Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
#45Semiconductor element built-in wiring board and method for manufacturing the same
#46Method for contacting and rewiring an electronic component embedded into a printed circuit board
#47Low profile reinforced package-on-package semiconductor device
#48Method of multi-chip wafer level packaging
#49Embedding low-k materials in antennas
#50Embedding thin chips in polymer
#51Power overlay structure having wirebonds and method of manufacturing same
#52Embedded package and method thereof
#53Circuit substrate interconnect
#54Method for manufacturing device embedded substrate, and device embedded substrate
#55Semiconductor package and method of manufacturing the semiconductor package
#56Package structure and fabrication method thereof
#57Hybrid interconnect for chip stacking
#58High density chip-to-chip connection
#59Semiconductor structure and manufacuting method of the same
#60Printed circuit board, and method for manufacturing same
#61Method for interconnecting stacked semiconductor devices
#62Battery built-in board and method for manufacturing the same
#63Method of packaging stacked dies on wafer using flip-chip bonding
#64Electronic component package and method for manufacturing same
#65Semiconductor device
#66Microelectronic structures having laminated or embedded glass routing structures for high density packaging
#67Chip package and method for forming the same
#68Semiconductor package and method for manufacturing the same
#69Semiconductor device and method for manufacturing a semiconductor device
#70Semiconductor device, manufacturing method thereof, and electronic apparatus
#71Integrated circuit device packages and methods for manufacturing integrated circuit device packages
#72Semiconductor device with pre-molding chip bonding
#73Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same
#74Connecting element for a multi-chip module and multi-chip module
#75Semiconductor device, manufacturing method thereof, and electronic apparatus
#76Printed circuit board including embedded electronic component and method for manufacturing the same
#77Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB
#78Die seal ring for integrated circuit system with stacked device wafers
#79Photoactive compound gradient photoresist
#80Circuit board incorporating electronic component and manufacturing method thereof
#81Microelectronic structures having laminated or embedded glass routing structures for high density packaging
#82Printed circuit board and method for manufacturing the same
#83Techniques for reducing inductance in through-die vias of an electronic assembly
#84Semiconductor package and method of fabricating the same
#85Semiconductor device with pre-molding chip bonding
#86PREVENTION OF THRU-SUBSTRATE VIA PISTONING USING HIGHLY DOPED COPPER ALLOY SEED LAYER
#87Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
#88Reconstituted wafer-level package DRAM
#89System-level packaging methods and structures
#90Circuit module with multiple submodules
#91Method of Multi-Chip Wafer Level Packaging
#92Multi-chip wafer level package
#93Microelectronic package with stacked microelectronic elements and method for manufacture thereof
#94Photoactive compound gradient photoresist
#95Semiconductor device and manufacturing of the semiconductor device
#96Semiconductor device and method of forming WLCSP structure using protruded MLP
#97Semiconductor device and method of manufacturing semiconductor device
#98Semiconductor device and fabrication method therefor
#99Semiconductor device and method of forming WLCSP structure using protruded MLP
#100Multichip Packages
#101Device including two semiconductor chips and manufacturing thereof
#102Semiconductor device, manufacturing method thereof, and electronic apparatus
#1033D integrated circuits structure
#104Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
#105Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
#106Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
#107Interconnect structure comprising blind vias intended to be metalized
#108Semiconductor device and method of manufacturing the same, and electronic apparatus
#109METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE
#110Three-dimensional integrated circuits and techniques for fabrication thereof
#111Image sensors and methods of manufacturing image sensors
#112Component-Embedded Printed Circuit Board
#113Die package and method of manufacturing the same
#114Package-on-package technology for fan-out wafer-level packaging
#115System-in packages
#116Integrated circuit micro-module
#117Integrated circuit micro-module
#118Method of making 3D integrated circuits
#119MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME
#120Method of manufacturing a stacked die module
#121Semiconductor device
#122Method for manufacturing a multichip module assembly
#123Semiconductor package using through-electrodes having voids
#124Compact multi-port cam cell implemented in 3D vertical integration
#125Three-dimensional integrated circuits and techniques for fabrication thereof
#126Method for fabricating component-embedded printed circuit board
#127Process for fabricating a high-integration-density image sensor
#128Semiconductor device package interconnections
#129Interposers, electronic modules, and methods for forming the same
#130Multi-chips package structure and the method thereof
#131Method for manufacturing stack package using through-electrodes
#132Structure of embedded active components and manufacturing method thereof
#133Manufacturing method of semiconductor device
#134Method for fabricating stacked semiconductor components
#135Three-dimensional chip-stack package and active component on a substrate
#136Compact multi-port CAM cell implemented in 3D vertical integration
#137Component-embedded circuit board fabrication method
#138Three dimensional device integration method and integrated device
#139Three dimensional device integration method and integrated device
#140Three dimensional device integration method and integrated device
#141Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#142Multilayered circuit substrate with semiconductor device incorporated therein
#143Three dimensional device integration method and integrated device
#144Stacked semiconductor component
#145Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
#146Structure of embedded active components and manufacturing method thereof
#147Circuit apparatus provided with asperities on substrate surface
#148Circuit device and manufacturing method thereof
#149Package module for an IC device and method of forming the same
#150Arrangement for authentication of a person
#151Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device