211122 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Pre-treatment of the connector or the bonding area; Reshaping, e.g. forming vias by heating means using a laser
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF CIRCUIT BOARD
#302Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
#303RFID tags and processes for producing RFID tags
#304Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
#305Method of fabricating a power electronic device
#306Semiconductor device
#307Thermal enhanced low profile package structure and method for fabricating the same
#308Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#309Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#310Method for making a device including placing a semiconductor chip on a substrate
#311SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#312Printed wiring board with built-in semiconductor element, and process for producing the same
#313Optoelectronic component with a wireless contacting
#314Semiconductor device and method of manufacturing semiconductor device
#315Method of manufacturing semiconductor package
#316Method of manufacturing a package board
#317Method for producing a power semiconductor module comprising surface-mountable flat external contacts
#318INTEGRATED CIRCUIT DEVICE
#319Integrated circuit device having a gas-phase deposited insulation layer
#320Semiconductor device
#321Semiconductor device
#322Integrated shielding process for precision high density module packaging
#323Semiconductor packaging process using through silicon vias
#324Method of manufacturing semiconductor package using redistribution substrate
#325Semiconductor device including semiconductor constituent and manufacturing method thereof
#326SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#327Method for making contact with a contact surface on a substrate
#328Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof
#329Stackable semiconductor package with encapsulant and electrically conductive feed-through
#330INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME
#331Semiconductor device
#332PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK
#333Method of making demountable interconnect structure
#334Parallel chip embedded printed circuit board and manufacturing method thereof
#335METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
#336Power semiconductor packaging method and structure
#337Semiconductor device and method for manufacturing same
#338Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same
#339Manufacture of a layer including a component
#340CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
#341Semiconductor packages with enhanced joint reliability and methods of fabricating the same
#342Semiconductor package with under bump metallization aligned with open vias
#343Same size die stacked package having through-hole vias formed in organic material
#344Semiconductor die with through-hole via on saw streets and through-hole via in active area of die
#345Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
#346Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
#347Connecting microsized devices using ablative films
#348Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same
#349Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same
#350Semiconductor device and method of manufacturing the same
#351Packaging methods for imager devices
#352Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate
#353Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate
#354Electronic package and manufacturing method thereof
#355Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component
#356Wiring structure, forming method of the same and printed wiring board
#357Method for manufacturing a circuit board structure
#358Multilayer substrate including components therein
#359Method for manufacturing a circuit board
#360Electronics module and method for manufacturing the same
#361Hybrid module and method of manufacturing the same
#362Printed circuit board
#363Circuit board structure having embedded semiconductor element and fabrication method thereof
#364Thinned die integrated circuit package
#365Wiring structure of printed wiring board and method for manufacturing the same
#366Printed circuit board
#367Printed circuit board
#368Semiconductor component including a semiconductor chip and a passive component
#369Packaged microelectronic devices and methods for packaging microelectronic devices
#370SEMICONDUCTOR CHIP EMBEDDED IN AN INSULATOR AND HAVING TWO-WAY HEAT EXTRACTION
#371Printed circuit board and fabricating method thereof
#372PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CHIPS AND METHOD OF FABRICATING THE SAME
#373Packaged microelectronic devices and methods for packaging microelectronic devices
#374Packaging with base layers comprising alloy 42
#375Embedded chip package
#376Metallised film for sheet contacting
#377METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY
#378SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
#379Multi-layered printed circuit board having integrated circuit embedded therein
#380Structure of wafer level package with area bump
#381Method for embedding a component in a base
#382Method of packaging and interconnection of integrated circuits
#383Method of fabricating microelectronic devices
#384Carrier board structure with embedded semiconductor chip and fabrication method thereof
#385Semiconductor package device
#386Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#387Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein
#388Method for producing a dielectric layer for an electronic component
#389Electronic parts packaging structure and method of manufacturing the same
#390Multilayer printed circuit board
#391System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System
#392Printed circuit board and method of manufacturing the same
#393Semiconductor Module Having Low Thermal Load
#394Power semiconductor device connected in distinct layers of plastic
#395Method for manufacturing an electronics module
#396Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#397Heat sink structure for embedded chips and method for fabricating the same
#398Printed circuit board
#399Method and apparatus for laser processing
#400Systems and methods for high density multi-component modules
#401Power semiconductor component, power semiconductor device as well as methods for their production
#402Power semiconductor module having surface-mountable flat external contacts and method for producing the same
#403Direct-write wafer level chip scale package
#404Power semiconductor module and fabrication method
#405Heat conduction from an embedded component
#406Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#407Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#408Method for embedding a component in a base
#409Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
#410Wafer-leveled chip packaging structure and method thereof
#411Semiconductor package having an optical device and a method of making the same
#412Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
#413Semiconductor device and method of manufacturing the same
#414Bare chip embedded PCB
#415Method for manufacturing an electronic module in an installation base
#416Circuit board, semiconductor device, and manufacturing method of circuit board
#417Method for manufacturing IC-embedded substrate
#418Method for manufacturing an electronic module, and an electronic module
#419Semiconductor device and method of manufacturing the same
#420Semiconductor device and method of manufacturing the same
#421Semiconductor device with a wiring substrate and method for producing the same
#422Multilayer circuit board and method for manufacturing the same
#423Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same
#424Structure for protecting electronic packaging contacts from stress
#425Semiconductor device with electroless plating metal connecting layer and method for fabricating the same
#426Hybrid module and method of manufacturing the same
#427Stackable device, device stack and method for fabricating the same
#428Semiconductor IC-embedded substrate and method for manufacturing same
#429Encapsulated electronic part packaging structure
#430Device transferring method, and device arraying method
#431Method of packaging and interconnection of integrated circuits
#432Power semiconductor packaging method and structure
#433Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
#434Electronic parts packaging structure and method of manufacturing the same
#435Parallel chip embedded printed circuit board and manufacturing method thereof
#436Printed circuit board having embedded RF module power stage circuit
#437Method of embedding semiconductor chip in support plate
#438Wiring board and method for manufacturing the same
#439RFID tags and processes for producing RFID tags
#440Wafer level pre-packaged flip chip systems
#441Wafer level pre-packaged flip chip
#442Wafer level pre-packaged flip chip
#443Wafer level pre-packaged flip chip system
#444Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
#445Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
#446Method of manufacturing a semiconductor apparatus
#447Circuit board with built-in electronic component and method for manufacturing the same
#448Thermal enhanced low profile package structure
#449Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein
#450Shield and semiconductor die assembly
#451Wiring board manufacturing method
#452Semiconductor package having an optical device and a method of making the same
#453Hybrid module and production method for same, and hybrid circuit device
#454Electronic device package and method of manufacturing the same
#455Printed circuit board including embedded chips and method of fabricating the same
#456Electronic parts packaging structure
#457Package structure with embedded chip and method for fabricating the same
#458Method for fabricating semiconductor components with conductive vias
#459Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
#460Transponder incorporated into an electronic device
#461Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
#462Substrate structure with embedded chip of semiconductor package and method for fabricating the same
#463Electronic parts packaging structure and method of manufacturing the same
#464Semiconductor electrical connection structure and method of fabricating the same
#465Semiconductor device and method of manufacturing semiconductor device
#466Method of embedding semiconductor chip in support plate and embedded structure thereof
#467Semiconductor and method for producing a semiconductor
#468Packaged microelectronic devices and methods for packaging microelectronic devices
#469Wafer-leveled chip packaging structure and method thereof
#470Method of fabricating PCB including embedded passive chip
#471Method of manufacturing electronic part packaging structure
#472Method of manufacturing semiconductor device
#473Multilayer substrate including components therein
#474Method of manufacturing an electronic parts packaging structure
#475Method for embedding a component in a base
#476Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#477Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#478Electronic parts packaging structure and method of manufacturing the same
#479Semiconductor device
#480Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#481Semiconductor device having conducting portion of upper and lower conductive layers
#482Device transferring method
#483Device transferring method
#484Device transferring method
#485Device transferring method, and device arraying method and image display unit fabricating method using the same
#486Method of embedding components in multi-layer circuit boards
#487Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
#488Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#489Power semiconductor module and method for producing it
#490Method for embedding a component in a base and forming a contact
#491Module board having embedded chips and components and method of forming the same
#492Thinned die integrated circuit package
#493Electronics circuit manufacture
#494Test system with interconnect having conductive members and contacts on opposing sides
#495Method of manufacturing electronic device and method of manufacturing electro-optical device
#496Electronic parts packaging structure and method of manufacturing the same
#497Modular electronic assembly and method of making
#498Multi-chip package and manufacturing method thereof
#499Module with embedded semiconductor IC and method of fabricating the module
#500Circuit board with built-in electronic component and method for manufacturing the same
#501Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same