211124 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Pre-treatment of the connector or the bonding area; Reshaping, e.g. forming vias by mechanical means, e.g. severing, pressing, stamping
Method for interconnecting stacked semiconductor devices
#2Method for interconnecting stacked semiconductor devices
#3SYSTEMS AND METHODS FOR FLASH STACKING
#4Method of manufacturing semiconductor devices, corresponding device and circuit
#5Method for interconnecting stacked semiconductor devices
#6Systems and methods for flash stacking
#7Semiconductor device and method of forming substrate including embedded component with symmetrical structure
#8Method of manufacturing semiconductor devices, corresponding device and circuit
#9Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
#10Efficient heat removal from component carrier with embedded diode
#11Method for interconnecting stacked semiconductor devices
#12Semiconductor device and method of forming substrate including embedded component with symmetrical structure
#13Backside drill embedded die substrate
#14Microelectronic package with stacked microelectronic units and method for manufacture thereof
#15Radio die package with backside conductive plate
#16Apparatus, system, and method for wireless connection in integrated circuit packages
#17Semiconductor device and method of forming substrate including embedded component with symmetrical structure
#18Electronic packages and methods of making and using the same
#19Chip package and chip assembly
#20Embedded semiconductor device package and method of manufacturing thereof
#21Apparatus, system, and method for wireless connection in integrated circuit packages
#22Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer
#23Embedded semiconductor device package and method of manufacturing thereof
#24Ceramic multilayer substrate and method for producing the same
#25Integration of laminate MEMS in BBUL coreless package
#26Stacked type power device module
#27Stacked packaging using reconstituted wafers
#28Low profile surface mount package with isolated tab
#29Apparatus, system, and method for wireless connection in integrated circuit packages
#30CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
#31Apparatus, system, and method for wireless connection in integrated circuit packages
#32Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#33Method of manufacturing a semiconductor device
#34Semiconductor package and methods of formation thereof
#35Stacked Packaging Using Reconstituted Wafers
#36Microelectronic package with stacked microelectronic units and method for manufacture thereof
#37Manufacturing electronic device having contact elements with a specified cross section
#38Semiconductor package with embedded die and manufacturing methods thereof
#39Device including two mounting surfaces
#40Apparatus, system, and method for wireless connection in integrated circuit packages
#41Method of chip package build-up
#42Power semiconductor module and fabrication method
#43Method of manufacturing printed wiring board
#44Method of manufacturing printed circuit board including electronic component embedded therein
#45Method of manufacturing printed wiring board with built-in electronic component
#46Method of manufacturing a printed circuit board (PCB)
#47Semiconductor device and manufacturing method thereof
#48ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
#49Printed circuit board
#50Semiconductor device and method for manufacturing the same
#51Semiconductor device package structure and method for the same
#52Power electronic device
#53HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE
#54Apparatus, system, and method for wireless connection in integrated circuit packages
#55Method for manufacturing multilayer wiring substrate
#56Printed circuit board and method of manufacturing printed circuit board
#57System and method for stacked die embedded chip build-up
#58SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
#59Electronics module comprising an embedded microcircuit
#60Circuit board including an embedded component
#61Ceramic multilayer substrate and method for producing the same
#62Method of manufacturing a chip embedded printed circuit board
#63Electronic device package and method of manufacturing the same
#64WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
#65Multilayer circuit board and method for manufacturing the same
#66Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#67Device including two mounting surfaces
#68Lock and key through-via method for wafer level 3 D integration and structures produced
#69CHIP CAPACITOR EMBEDDED PWB
#70Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material
#71Method of manufacturing printed wiring board with built-in electronic component
#72Semiconductor device
#73Semiconductor device and method of manufacturing a semiconductor device
#74Printed circuit board
#75Semiconductor embedded module and method for producing the same
#76Manufacturing method of printed circuit board having electro component
#77Electronic device having contact elements with a specified cross section and manufacturing thereof
#78Printed circuit board including electronic component embedded therein and method of manufacturing the same
#79COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME
#80Method for the production of a semiconductor component comprising a planar contact, and semiconductor component
#81Package structure for integrated circuit device and method of the same
#82Semiconductor module
#83Component built-in wiring board
#84Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#85Microelectronic devices
#86Semiconductor module
#87Semiconductor IC-embedded substrate and method for manufacturing same
#88Method of manufacturing printed wiring board with built-in electronic component
#89Method of manufacturing printed wiring board with built-in electronic component
#90Semiconductor device including wiring and manufacturing method thereof
#91Semiconductor device having wiring line and manufacturing method thereof
#92Method of fabricating a power electronic device
#93Semiconductor device
#94MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUCH MODULE
#95SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#96Method for making contact with a contact surface on a substrate
#97Stackable semiconductor package with encapsulant and electrically conductive feed-through
#98Semiconductor device
#99PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK
#100Parallel chip embedded printed circuit board and manufacturing method thereof
#101Power semiconductor packaging method and structure
#102CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
#103Semiconductor packages with enhanced joint reliability and methods of fabricating the same
#104Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same
#105Substrate process for an embedded component
#106Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate
#107Multilayer substrate including components therein
#108Method for manufacturing a circuit board
#109Electronics module and method for manufacturing the same
#110Printed circuit board
#111Printed circuit board
#112Printed circuit board
#113Circuit module and power line communication apparatus
#114Metallised film for sheet contacting
#115Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#116Method of fabricating microelectronic devices
#117Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#118Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#119Method for manufacturing an electronics module
#120Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#121Printed circuit board
#122Power semiconductor module and fabrication method
#123Bare chip embedded PCB
#124Method for manufacturing an electronic module, and an electronic module
#125Multilayer circuit board and method for manufacturing the same
#126Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same
#127Multilayered circuit substrate with semiconductor device incorporated therein
#128Stackable device, device stack and method for fabricating the same
#129Semiconductor IC-embedded substrate and method for manufacturing same
#130Power semiconductor packaging method and structure
#131Method of forming a connecting conductor and wirings of a semiconductor chip
#132Parallel chip embedded printed circuit board and manufacturing method thereof
#133Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
#134Method of manufacturing a semiconductor apparatus
#135Circuit board with built-in electronic component and method for manufacturing the same
#136Embedded chip printed circuit board and method of manufacturing the same
#137Electronic device package and method of manufacturing the same
#138Semiconductor module, process for producing the same, and film interposer
#139Electronic component embedded substrate and method for manufacturing the same
#140Component built-in module and method for producing the same
#141Multilayer substrate including components therein
#142Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#143Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#144Semiconductor device having conducting portion of upper and lower conductive layers
#145Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#146Electronics circuit manufacture
#147Multi-chip package and manufacturing method thereof
#148Circuit board with built-in electronic component and method for manufacturing the same