211139 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Forming a build-up interconnect by additive methods, e.g. direct writing using jetting, e.g. ink jet
Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core Shells
#2LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
#3Circuits including micropatterns and using partial curing to adhere dies
#4Light emitting diode display with redundancy scheme
#5Display device and method for manufacturing display device
#6Method for producing an electrically conductive connection on a substrate, microelectronic device and method for the production thereof
#7Control device
#8Light emitting diode display with redundancy scheme
#9Semiconductor package
#10Interconnect Structure for High Power GaN Module
#11Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummies
#12Light emitting diode display with redundancy scheme
#13Method and fixture for chip attachment to physical objects
#14Methods and apparatus for measuring analytes using large scale FET arrays
#15Patterned structure for electronic device and manufacturing method thereof
#16Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#17Light emitting diode display with redundancy scheme
#18Circuit structure
#193D printed hermetic package assembly and method
#20Remapped packaged extracted die with 3D printed bond connections
#21Conductive connections, structures with such connections, and methods of manufacture
#22System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
#23SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#24Methods and apparatus for measuring analytes using large scale FET arrays
#25Semiconductor package with conductive clip
#26Laser assisted transfer welding process
#27Integrated circuit with printed bond connections
#28Light emitting diodes and a method of packaging the same
#29Electrical connector between die pad and z-interconnect for stacked die assemblies
#30Selective die electrical insulation by additive process
#31Conductive connections, structures with such connections, and methods of manufacture
#32Light emitting diode display with redundancy scheme
#33Semiconductor package with conductive clip
#34Power semiconductor package with conductive clip and related method
#35RFID tags and processes for producing RFID tags
#36Semiconductor device including embedded controller die and method of making same
#37Preparation method of a thin power device
#38Semiconductor packages and methods of forming the same
#39Light emitting diodes and a method of packaging the same
#40Method for manufacturing a fan-out WLP with package
#41Wireless electric power supply type light-emitting element and light-emitting device
#42Method of fabricating a light emitting diode display with integrated defect detection test
#43Method and apparatus for printing integrated circuit bond connections
#44Embedded package and method of manufacturing the same
#45Electronic assembly with three dimensional inkjet printed traces
#46Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
#47Discrete device mounted on substrate
#48Laminate electronic device
#49Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
#50Electronic assembly with three dimensional inkjet printed traces
#51Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#52Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#53RFID tags and processes for producing RFID tags
#54High density sensor array without wells
#55Methods and apparatus for measuring analytes using large scale FET arrays
#56Direct write interconnections and method of manufacturing thereof
#57Electrically bonded arrays of transfer printed active components
#58Semiconductor device and methods of manufacturing semiconductor devices
#59Support mounted electrically interconnected die assembly
#60Semiconductor packages and methods of forming the same
#61Methods and apparatus for measuring analytes using large scale FET arrays
#62Methods and apparatus for measuring analytes using large scale FET arrays
#63Methods and apparatus for measuring analytes using large scale FET arrays
#64Laminate electronic device
#65Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance
#66Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
#67Manufacturing electronic device having contact elements with a specified cross section
#68Method of manufacturing a semiconductor device
#69Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
#70Optoelectronic component and method for producing an opto-electronic component
#71Semiconductor module having deflecting conductive layer over a spacer structure
#72Light-emitting diode arrangement and method for producing the same
#73Device including two mounting surfaces
#74Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
#75Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#76Electrical connector between die pad and z-interconnect for stacked die assemblies
#77Laser assisted transfer welding process
#78Semiconductor package and method of fabricating the same
#79Electronic assemblies and methods of forming electronic assemblies
#80Semiconductor device and manufacturing method thereof
#81Methods and apparatus for measuring analytes using large scale FET arrays
#82Power semiconductor package
#83Method for forming terminal of stacked package element and method for forming stacked package
#84Electronic component module and method of manufacturing the same
#85Method of manufacturing printed circuit board including electronic component embedded therein
#86Interconnect structure
#87Stacked die assembly having reduced stress electrical interconnects
#88Selective die electrical insulation by additive process
#89Methods and apparatus for measuring analytes using large scale FET arrays
#90Methods and apparatus for measuring analytes using large scale FET arrays
#91Mount board and electronic device
#92Semiconductor package
#93Methods and apparatus for measuring analytes using large scale FET arrays
#94Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device
#95Methods and apparatus for measuring analytes using large scale FET arrays
#96Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#97Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#98RFID tags and processes for producing RFID tags
#99IC chip, antenna, and manufacturing method of the IC chip and the antenna
#100METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE
#101System support for electronic components and method for production thereof
#102Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts
#103Wiring forming method
#104Laminate electronic device
#105Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP
#106Method of processing cavity of core substrate
#107Radio frequency identification tag, and method of manufacturing the same
#108Electrically interconnected stacked die assemblies
#109Semiconductor device and method of manufacturing semiconductor device
#110Method of manufacturing a semiconductor device
#111Electrical interconnect for die stacked in zig-zag configuration
#112SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#113Processes and structures for IC fabrication
#114MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#115Stacked package and method for forming stacked package
#116Semiconductor chip package with post electrodes
#117Power electronic device
#118Method for making a semiconductor device on a flexible substrate
#119Method of fabricating a semiconductor device
#120Process for placing, securing and interconnecting electronic components
#121Method of manufacturing a semiconductor device
#122SEMICONDUCTOR DEVICE
#123Method of manufacturing a semiconductor device
#124SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL
#125Method for producing electronic component and electronic component
#126SOLVENT SOFTENING TO ALLOW DIE PLACEMENT
#127Wiring structure between steps and wiring method thereof
#128SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#129Semiconductor device having stacked multiple substrates and method for producing same
#130Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layers
#131CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
#132CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
#133FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
#134Semiconductor device
#135Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device
#136Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#137Device including two mounting surfaces
#138Thermal barrier layer for integrated circuit manufacture
#139Solvent softening to allow die placement
#140Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material
#141CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTURING PROCESS FOR THE CIRCUIT SUBSTRATE
#142Method for forming terminal of stacked package element and method for forming stacked package
#143Method of fabricating electronic device having stacked chips
#144Light-emitting diode arrangement and method for producing the same
#145Electronic device having contact elements with a specified cross section and manufacturing thereof
#146Securing integrated circuit dice to substrates
#147Printed circuit board including electronic component embedded therein and method of manufacturing the same
#148Semiconductor device and method for manufacturing the same
#149CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCESS OF FABRICATING THE SAME
#150Light-emitting diode display and method for manufacturing the same
#151Semiconductor module
#152Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#153Semiconductor module
#154Support mounted electrically interconnected die assembly
#155Treatment of items
#156Electronic device and method of manufacturing same
#157Semiconductor module
#158Semiconductor module
#159RFID tags and processes for producing RFID tags
#160Method of fabricating a power electronic device
#161Circuit arrangements and associated apparatus and methods
#162Method of printing electronic circuits
#163Method for making a device including placing a semiconductor chip on a substrate
#164Method of manufacturing a package board
#165Thin semiconductor device package
#166Assembly comprising a functional device and a resonator and method of making same
#167Method for manufacturing a stacked semiconductor package, and stacked semiconductor package
#168Method for producing a power semiconductor module comprising surface-mountable flat external contacts
#169Semiconductor device and methods of manufacturing semiconductor devices
#170Stacked semiconductor chips
#171Semiconductor device
#172Semiconductor device
#173Electrical Interconnect Formed by Pulsed Dispense
#174METHOD OF FORMING A SEMICONDUCTOR DIE HAVING A SLOPED EDGE FOR RECEIVING AN ELECTRICAL CONNECTOR
#175STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME
#176Semiconductor element and semiconductor device
#177INTERCONNECT STRUCTURE
#178Semiconductor module
#179Methods and apparatus for measuring analytes using large scale FET arrays
#180Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof
#181Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly
#182Mount Board and Electronic Device
#183Semiconductor device
#184RECOVERABLE ELECTRONIC COMPONENT
#185Electrically interconnected stacked die assemblies
#186Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
#187Connecting microsized devices using ablative films
#188Inkjet printed wirebonds, encapsulant and shielding
#189Semiconductor device and its manufacturing method
#190Silicon chip having inclined contact pads and electronic module comprising such a chip
#191Semiconductor module having deflecting conductive layer over a spacer structure
#192Electronics Package And Manufacturing Method Thereof
#193System and method for separating and packaging integrated circuits
#194Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof
#195Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
#196Manufacturing method of electronic board and multilayer wiring board
#197WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#198Component-embedded circuit board fabrication method
#199Method for manufacturing electronic substrate
#200Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
#201Process of fabricating a semiconductor package
#202Web process interconnect in electronic assemblies
#203Method of packaging and interconnection of integrated circuits
#204IC chip, antenna, and manufacturing method of the IC chip and the antenna
#2053D electronic packaging structure having a conductive support substrate
#206Wiring module
#207Thin semiconductor device package
#208Chip scale surface mount package for semiconductor device and process of fabricating the same
#209Semiconductor package
#210Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
#211Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#212Electronic device and method of manufacturing the same, circuit board, and electronic instrument
#213System and method for separating and packaging integrated circuits
#214Apparatus incorporating small-feature-size and large-feature-size components and method for making same
#215Semiconductor device with inclined through holes
#216Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#217Method of packaging and interconnection of integrated circuits
#218Apparatuses and methods facilitating functional block deposition
#219Semiconductor device
#220Method of making an electronic device using an electrically conductive polymer, and associated products
#221Apparatuses and methods for forming assemblies
#222Optical element
#223RFID tags and processes for producing RFID tags
#224Method of making an electronic device using an electrically conductive polymer, and associated products
#225Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
#226Light emitting device package and method for manufacturing the same
#227Method of manufacturing multi-layered substrate
#228Semiconductor package
#229Semiconductor device having a plastic housing and external connections and method for producing the same
#230Manufacturing method for electronic device
#231Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
#232Assembly comprising functional devices and method of making same
#233Manipulation of micrometer-sized electronic objects with liquid droplets
#234Method for mounting an electronic element on a wiring board
#235Electronic device package and electronic equipment
#236Electronic device package and electronic equipment
#237Electronic device and method of manufacturing the same
#238RFID tag and method of manufacturing RFID tag
#239Method of manufacturing active matrix substrate with height control member
#240Web fabrication of devices
#241Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
#242Active matrix substrate with height control member
#243Flip-chip type semiconductor devices and conductive elements thereof
#244Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#245Carrier substrates and conductive elements thereof
#246Apparatuses and methods for forming assemblies
#247Method for manufacturing circuit board, circuit board, and electronic equipment
#248Electrical connection of components
#249Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment
#250Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus
#251Method of manufacturing electronic device and method of manufacturing electro-optical device
#252Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit
#253Electronic devices with small functional elements supported on a carrier
#254Circuit board and method of manufacturing the same
#255Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
#256Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus
#257Selective consolidation processes for electrically connecting contacts of semiconductor device components