211234 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area; Cleaning the layer connector, e.g. oxide removal step, desmearing Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow
LAND-SIDE DIE COOLING OF DOUBLE-SIDED PACKAGE SUBSTRATES
#2Semiconductor device production method
#3Die tray with channels
#4Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
#5Micro-pillar assisted semiconductor bonding
#6Method for bonding substrates
#7Light-emitting device with reflective resin
#8Method and structure for wafer to wafer bonding in semiconductor packaging