H01L2224/8301 - CPC Classification Index

ClassID:

211232 ⎘

H01L2224/8301 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area Cleaning the layer connector, e.g. oxide removal step, desmearing

Sub-classes:

H01L2224/83011 » Chemical cleaning, e.g. etching, flux 43
H01L2224/83012 » Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow 7
H01L2224/83013 » Plasma cleaning 39
H01L2224/83014 » Thermal cleaning, e.g. decomposition, sublimation 6
H01L2224/83019 » Combinations of two or more cleaning methods provided for in at least two different groups from to 0

Recent Application in this class:

20250309176

BONDING LAYERS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING

20250046744

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

20240355900

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

20230378121

BONDING APPARATUS AND BONDING METHOD

20220139869

DIRECT BONDING METHODS AND STRUCTURES

20180350639

Gas-controlled bonding platform for edge defect reduction during wafer bonding

20180082864

Gas-controlled bonding platform for edge defect reduction during wafer bonding

20180082863

Gas-controlled bonding platform for edge defect reduction during wafer bonding

20180013260

Bonding interface layer

20160322328

Method for low temperature bonding and bonded structure

20160086913

Method for low temperature bonding and bonded structure

20160071817

Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

20150364441

Micro-pillar assisted semiconductor bonding

20150318260

Gas-controlled bonding platform for edge defect reduction during wafer bonding

20150287696

Mounting method

20150048523

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

20130157412

Chip on wafer bonder

20120097638

Method For Low Temperature Bonding And Bonded Structure

20110067803

Method for low temperature bonding and bonded structure

20100163169

Method for low temperature bonding and bonded structure

20090263953

Method for low temperature bonding and bonded structure

20090142903

Chip on wafer bonder

20080286958

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

20080185739

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

20080063878

Method for low temperature bonding and bonded structure

20080053959

Method for low temperature bonding and bonded structure

20070278637

Circuit Arrangement, System Carrier and Methods for Producing Same

20070160936

Adhesion method using gray-scale photolithography

20060097366

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

20050079712

Method for low temperature bonding and bonded structure