211236 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area; Cleaning the layer connector, e.g. oxide removal step, desmearing Thermal cleaning, e.g. decomposition, sublimation
Bonding structure on gold thin film
#2Semiconductor device and method of fabricating same
#33D integrated heterostructures having low-temperature bonded interfaces with high bonding energy
#4Metallic thermal joint for high power density chips
#5Method and structure for wafer to wafer bonding in semiconductor packaging
#6Low-temperature bonding process