ClassID:

211237

H01L2224/83019 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area; Cleaning the layer connector, e.g. oxide removal step, desmearing Combinations of two or more cleaning methods provided for in at least two different groups from  -