211242 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area Reshaping the layer connector in the bonding apparatus, e.g. flattening the layer connector
Sub-classes:DIRECT BONDING OF SEMICONDUCTOR ELEMENTS
#2Selective recess
#3Process for fabricating a transistor structure including a plugging step
#4Wafer bonding edge protection using double patterning with edge exposure
#5Three dimensional device integration method and integrated device
#6Device and method for permanent bonding
#7Wafer bonding edge protection using double patterning with edge exposure
#8Method for low temperature bonding and bonded structure
#9Three dimensional device integration method and integrated device
#10Method for low temperature bonding and bonded structure
#11Three dimensional device integration method and integrated device
#12Methods and materials useful for chip stacking, chip and wafer bonding
#13Methods and materials useful for chip stacking, chip and wafer bonding
#14Method For Low Temperature Bonding And Bonded Structure
#15Method for low temperature bonding and bonded structure
#16Method for low temperature bonding and bonded structure
#17Method for low temperature bonding and bonded structure
#18Semiconductor device and manufacturing method thereof
#19Three dimensional device integration method and integrated device
#20Methods and materials useful for chip stacking, chip and wafer bonding
#21Method for low temperature bonding and bonded structure
#22Three dimensional device integration method and integrated device
#23Three dimensional device integration method and integrated device
#24Method for low temperature bonding and bonded structure
#25Three dimensional device integration method and integrated device
#26Method for low temperature bonding and bonded structure