ClassID:

211244

H01L2224/83035 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area; Reshaping the layer connector in the bonding apparatus, e.g. flattening the layer connector by heating means

Sub-classes:
Recent Application in this class: