H01L2224/83205 - CPC Classification Index

#1

20250300107

2025-09-25

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#2

20250285944

2025-09-11

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#3

20240234366

2024-07-11

CIRCUIT BOARD AND MANUFACTURING METHOD

#4

20240136325

2024-04-25

CIRCUIT BOARD AND MANUFACTURING METHOD

#5

20230326948

2023-10-12

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND IMAGING APPARATUS

#6

20220216177

2022-07-07

Display device including connection pad part and electronic component connected to connection pad part

#7

20220013517

2022-01-13

Display panel and manufacturing method for same

#8

20210392752

2021-12-16

Circuit board structure and method for manufacturing a circuit board structure

#9

20210013166

2021-01-14

Bond pad reliability of semiconductor devices

#10

20190181075

2019-06-13

Method of manufacturing semiconductor devices and corresponding semiconductor device

#11

20190088490

2019-03-21

Method for manufacturing a semiconductor component and a semiconductor component

#12

20190035762

2019-01-31

Method of manufacturing semiconductor device

#13

20180358246

2018-12-13

Transfer printing using ultrasound

#14

20180151533

2018-05-31

Manufacturing method for power semiconductor device, and power semiconductor device

#15

20170271295

2017-09-21

Electronic device and method for producing an electronic device

#16

20170071061

2017-03-09

Circuit board structure and method for manufacturing a circuit board structure

#17

20160351533

2016-12-01

Method for producing an integral join and automatic placement machine

#18

20160133712

2016-05-12

Semiconductor device and method of manufacturing the same

#19

20160079146

2016-03-17

Inter-connection of a lead frame with a passive component intermediate structure

#20

20150306701

2015-10-29

METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBSTRATE OF A POWER SEMICONDUCTOR MODULE BY WELDING

#21

20150228535

2015-08-13

Bonded processed semiconductor structures and carriers

#22

20150115458

2015-04-30

Semiconductor device and method for manufacturing a semiconductor device

#23

20150102425

2015-04-16

Methods and configuration for manufacturing flip chip contact (FCC) power package

#24

20150069638

2015-03-12

Metallic particle paste, cured product using same, and semiconductor device

#25

20150044496

2015-02-12

Jointed body, method for manufacturing same and jointed member

#26

20140110740

2014-04-24

Semiconductor device and production method therefor

#27

20140001615

2014-01-02

Package-in-packages and methods of formation thereof

#28

20130334292

2013-12-19

Method for manufacturing printed circuit boards

#29

20130277813

2013-10-24

Chip package and method of forming the same

#30

20130193575

2013-08-01

OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA

#31

20130193573

2013-08-01

Methods of stress balancing in gallium arsenide wafer processing

#32

20130105980

2013-05-02

SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR PRODUCING SAME, AND METHOD OF BONDING ELECTRONIC COMPONENT

#33

20130082387

2013-04-04

Power semiconductor arrangement and method for producing a power semiconductor arrangement

#34

20130001803

2013-01-03

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

#35

20120329182

2012-12-27

SEMICONDUCTOR DEVICE MOUNTING METHOD

#36

20120319268

2012-12-20

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

#37

20120312864

2012-12-13

Module including a sintered joint bonding a semiconductor chip to a copper surface

#38

20120306087

2012-12-06

Semiconductor device including excess solder

#39

20120305945

2012-12-06

Power semiconductor device

#40

20120305632

2012-12-06

Low void solder joint for multiple reflow applications

#41

20120298730

2012-11-29

Method for dispensing solder on a substrate and method for mounting semiconductor chips

#42

20120292773

2012-11-22

Method for producing a metal layer on a substrate and device

#43

20120261174

2012-10-18

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT

#44

20120235293

2012-09-20

SEMICONDUCTOR DEVICE INCLUDING A BASE PLATE

#45

20120214010

2012-08-23

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME

#46

20120211799

2012-08-23

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE

#47

20120187862

2012-07-26

Light emitting die (LED) packages and related methods

#48

20120184069

2012-07-19

Method for bonding of chips on wafers

#49

20120181682

2012-07-19

Semiconductor device

#50

20120175755

2012-07-12

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

#51

20120153486

2012-06-21

Light emitting semiconductor element bonded to a base by a silver coating

#52

20120146204

2012-06-14

SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES

#53

20120118480

2012-05-17

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME

#54

20120114927

2012-05-10

Sintering materials and attachment methods using same

#55

20120104618

2012-05-03

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

#56

20120097335

2012-04-26

Method and system for bonding electrical devices using an electrically conductive adhesive

#57

20120034742

2012-02-09

SEMICONDUCTOR DEVICE

#58

20120025393

2012-02-02

Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module

#59

20120018768

2012-01-26

LED-BASED LIGHT EMITTING DEVICES

#60

20120013013

2012-01-19

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

#61

20110316160

2011-12-29

Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate

#62

20110310568

2011-12-22

Circuit arrangement with shunt resistor

#63

20110304985

2011-12-15

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

#64

20110290863

2011-12-01

Sintering silver paste material and method for bonding semiconductor chip

#65

20110260307

2011-10-27

Integrated circuit including bond wire directly bonded to pad

#66

20110237031

2011-09-29

Semiconductor device and manufacturing method of the same

#67

20110204125

2011-08-25

Low temperature bonding material comprising coated metal nanoparticles, and bonding method

#68

20110189821

2011-08-04

Semiconductor device

#69

20110115068

2011-05-19

Power semiconductor module and method for operating a power semiconductor module

#70

20110089568

2011-04-21

Power semiconductor device and manufacturing method therefor

#71

20110045653

2011-02-24

Bonding method and bonding apparatus

#72

20110045641

2011-02-24

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

#73

20110045640

2011-02-24

Method and system for bonding electrical devices using an electrically conductive adhesive

#74

20110042815

2011-02-24

SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR

#75

20110037166

2011-02-17

Semiconductor device

#76

20110024890

2011-02-03

Stackable Package By Using Internal Stacking Modules

#77

20110017808

2011-01-27

Method for the low-temperature pressure sintering of electronic units to heat sinks

#78

20100270673

2010-10-28

Method for connecting two joining surfaces

#79

20100270515

2010-10-28

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

#80

20100258935

2010-10-14

Power semiconductor module comprising a connection device with internal contact spring connection elements

#81

20100237498

2010-09-23

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

#82

20100230798

2010-09-16

Semiconductor device including spacer element

#83

20100212153

2010-08-26

Method for fabricating a bond

#84

20100195292

2010-08-05

Electronic member, electronic part and manufacturing method therefor

#85

20100193801

2010-08-05

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

#86

20100187563

2010-07-29

Semiconductor device and production method therefor

#87

20100181628

2010-07-22

SEMICONDUCTOR DEVICE

#88

20100148364

2010-06-17

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

#89

20100133668

2010-06-03

Semiconductor device and manufacturing method thereof

#90

20100109016

2010-05-06

POWER SEMICONDUCTOR MODULE

#91

20100105174

2010-04-29

SEMICONDUCTOR DEVICE

#92

20100078202

2010-04-01

Printed circuit board for harsh environments

#93

20100068552

2010-03-18

MODULE INCLUDING A STABLE SOLDER JOINT

#94

20100065962

2010-03-18

Power semiconductor module including a multilayer substrate

#95

20100059857

2010-03-11

Method of fabricating a semiconductor device

#96

20100047491

2010-02-25

TRANSIENT LIQUID PHASE EUTECTIC BONDING

#97

20100032816

2010-02-11

Electronic device and method of manufacturing same

#98

20100025091

2010-02-04

Printed circuit boards

#99

20100019378

2010-01-28

Semiconductor module and a method for producing an electronic circuit

#100

20090305076

2009-12-10

Method of making foil based semiconductor package

#101

20090298278

2009-12-03

Method of bonding semiconductor devices utilizing solder balls

#102

20090294963

2009-12-03

Method for fabricating a module including a sintered joint

#103

20090253233

2009-10-08

Method of fabricating bonding structure

#104

20090244868

2009-10-01

Semiconductor device and bonding material

#105

20090206456

2009-08-20

Module including a sintered joint bonding a semiconductor chip to a copper surface

#106

20090203169

2009-08-13

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

#107

20090189264

2009-07-30

Semiconductor device and manufacturing method of the same

#108

20090179336

2009-07-16

Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module

#109

20090146298

2009-06-11

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

#110

20090085227

2009-04-02

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

#111

20090072414

2009-03-19

Bonding method of semiconductor and laminated structure fabricated thereby

#112

20090039498

2009-02-12

Power semiconductor module

#113

20090029504

2009-01-29

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

#114

20090008775

2009-01-08

Semiconductor device with welded leads and method of manufacturing the same

#115

20080315401

2008-12-25

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

#116

20080296782

2008-12-04

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

#117

20080284008

2008-11-20

Semiconductor device

#118

20080265386

2008-10-30

Semiconductor device

#119

20080258316

2008-10-23

Power semiconductor module

#120

20080202801

2008-08-28

Method for manufacturing a circuit board structure

#121

20080173398

2008-07-24

Low temperature bonding material comprising metal particles and bonding method

#122

20080160183

2008-07-03

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

#123

20080156398

2008-07-03

Bonding method and bonding material using metal particle

#124

20080122050

2008-05-29

Semiconductor Device And Production Method For Semiconductor Device

#125

20080105956

2008-05-08

Semiconductor element and process of manufacturing semiconductor element

#126

20080099916

2008-05-01

Bonding structure

#127

20080093729

2008-04-24

Semiconductor module arrangement

#128

20080064183

2008-03-13

METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER

#129

20080053617

2008-03-06

Interposer bonding device

#130

20070298244

2007-12-27

BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE

#131

20070284722

2007-12-13

Semiconductor device package utilizing proud interconnect material

#132

20070235732

2007-10-11

Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement

#133

20070228112

2007-10-04

Method and arrangement for forming a microelectronic package

#134

20070222042

2007-09-27

Semiconductor devices and electrical parts manufacturing using metal coated wires

#135

20070216012

2007-09-20

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

#136

20070190699

2007-08-16

Electronic device and method of manufacturing the same

#137

20070138648

2007-06-21

Schottky Diode Device with Aluminum Pickup of Backside Cathode

#138

20070128827

2007-06-07

Method and system for increasing yield of vertically integrated devices

#139

20070128821

2007-06-07

System and method for implementing transformer on package substrate

#140

20070114557

2007-05-24

Flip-chip light emitting diode device without sub-mount

#141

20070102489

2007-05-10

Ultrasonic welding head

#142

20070090515

2007-04-26

Semiconductor structure and method of assembly

#143

20070089291

2007-04-26

Electronic part mounting substrate and method for producing same

#144

20070031279

2007-02-08

Solder composition for electronic devices

#145

20070015352

2007-01-18

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

#146

20060284315

2006-12-21

Semiconductor device and circuit board

#147

20060267218

2006-11-30

Method for mounting an electronic part on a substrate using a liquid containing metal particles

#148

20060261133

2006-11-23

Method and device for producing a bondable area region on a carrier

#149

20060216855

2006-09-28

Schottky diode device with aluminum pickup of backside cathode

#150

20060214306

2006-09-28

Semiconductor chip and method manufacturing the same

#151

20060214274

2006-09-28

Semiconductor device and manufacturing method thereof

#152

20060197203

2006-09-07

Die structure of package and method of manufacturing the same

#153

20060185892

2006-08-24

Semiconductor device with micro connecting elements and method for producing the same

#154

20060169976

2006-08-03

Semiconductor device

#155

20060154404

2006-07-13

Die paddle clamping method for wire bond enhancement

#156

20060145319

2006-07-06

Flip chip contact (FCC) power package

#157

20060087019

2006-04-27

Multi-layer integrated semiconductor structure having an electrical shielding portion

#158

20060065967

2006-03-30

Apparatus for singulating and bonding semiconductor chips, and method for the same

#159

20060016855

2006-01-26

Strap bonding machine and method of manufacturing a semiconductor device

#160

20050253258

2005-11-17

Solder flow stops for semiconductor die substrates

#161

20050227416

2005-10-13

Electronic device and method of manufacture the same

#162

20050194638

2005-09-08

Semiconductor device

#163

20050194605

2005-09-08

Flip-chip light emitting diode device without sub-mount

#164

20050189658

2005-09-01

Semiconductor device assembly process

#165

20050148237

2005-07-07

Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate

#166

20050127504

2005-06-16

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

#167

20050121784

2005-06-09

Semiconductor device package utilizing proud interconnect material

#168

20050087881

2005-04-28

Electronic device

#169

20050056916

2005-03-17

Circuit device and manufacturing method of circuit device

#170

20050047101

2005-03-03

Electronic part mounting substrate and method for producing same

#171

15054907

2017-07-11

Semiconductor manufacturing method and associated semiconductor manufacturing system

#172

14271469

2015-06-23

Pre-formed via array for integrated circuit package