211334 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
#2INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME
#3MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS
#5Clip and related methods
#6Die with integrated microphone device using through-silicon vias (TSVs)
#7Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers
#8Clip and related methods
#9Composite substrate with alternating pattern of diamond and metal or metal alloy
#10Chip package and a method for manufacturing a chip package
#11Methods of attaching a die to a substrate