211331 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
Sub-classes:HEIGHT ADAPTABLE MULTILAYER SPACER
#2CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING A CHIP PACKAGE STRUCTURE
#3Conductive heat spreader and heat sink assembly for optical devices
#4Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#5Semiconductor device
#6Lead frames with wettable flanks
#7Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure
#8Reducing formation of oxide on solder
#9Semiconductor package substrate
#10Method for the production of an electronic component and electronic component produced according to this method
#11Reducing formation of oxide on solder
#12Semiconductor device and manufacturing method therefor
#13Semiconductor packages having increased input/output capacity and related methods
#14Method of manufacturing electronic device and electronic device
#15Electronic component mounting structure
#16I/O pad structures for integrated circuit devices
#17Systems and methods for additive connections in integrated circuits