211351 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Soldering or alloying Reflow soldering
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF THE SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#4MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
#5SOLDER THERMAL INTERFACE CORE ATTACHED WITH LOW-TEMPERATURE SOLDER PASTE FOR MICROELECTRONIC DEVICES
#6FLUX AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
#7INTEGRATED CIRCUIT ASSEMBLY WITH DIE COUPLED TO LID
#8SEMICONDUCTOR APPARATUS
#9SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#10SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#11SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#12POWER MODULE AND POWER CONVERSION APPARATUS
#13HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
#14CLIP
#15INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT
#16SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME
#17DUAL SWITCHING POWER DEVICE
#18HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELECTRONICS APPLICATIONS
#19ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#20Semiconductor Device and Method of Controlling Distribution of Liquid Metal TIM Using Lid Structure
#21STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
#22SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#23INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT
#24METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLY, AND APPLICATION OF SEMICONDUCTOR DEVICE ASSEMBLY
#25SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND APPLICATION THEREOF
#26Lead Frame, Packaging Structure and Packaging Method
#27POWER MODULE
#28SEMICONDUCTOR DEVICE
#29CONNECTING ARRANGEMENT
#30CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#31SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
#32SEMICONDUCTOR DEVICE
#33DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE MOUNT DEVICES
#34Electronic device with multi-layer contact and system
#35SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#36SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME
#37LIGHT-EMITTING DEVICE, BACKPLATE ASSEMBLY AND DISPLAY PANEL
#38Batch Soldering of Different Elements in Power Module
#39METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#40MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
#41SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
#42SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#43POWER MODULE
#44PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
#45CONTROLLED LOCAL HEATING OF SUBSTRATES
#46CHIP ARRANGEMENT
#47STENCIL MASK AND STENCIL PRINTING METHOD
#48PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT FILM
#49Structures for low temperature bonding using nanoparticles
#50DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE
#51MOUNTING ARRANGEMENTS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
#52SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#53SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#54POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINTED CIRCUIT BOARD
#55LIGHTING ELEMENT ALIGNMENT
#56SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD
#57SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#58Packaged electronic device with film isolated power stack
#59SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#60POWER SEMICONDUCTOR DEVICE
#61RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE
#62Methods for low temperature bonding using nanoparticles
#63SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#64Connection structure and manufacturing method therefor
#65ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CENTRAL INTERMETALLIC MESH STRUCTURE AND MESH-FREE EXTERIOR STRUCTURES
#66Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production
#67Method for Producing Power Semiconductor Module and Power Semiconductor Module
#68SEMICONDUCTOR DEVICE
#69Display device using micro LED, and manufacturing method therefor
#70SINTERING COMPOSITION
#71Semiconductor device with enhanced thermal dissipation and method for making the same
#72High reliability lead-free solder alloys for harsh environment electronics applications
#73Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure
#74Semiconductor device and method of manufacturing the same
#75SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#76Seal ring structures and methods of forming same
#77Semiconductor device and manufacturing method therefor
#78HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP
#79Light emitting device and manufacturing method therefor
#80Semiconductor device including a solder compound containing a compound Sn/Sb
#81Method for Fastening a Semiconductor Chip on a Substrate, and Electronic Component
#82Module with substrate recess for conductive-bonding component
#83Method for repairing a light-emitting device and a method for manufacturing an LED panel
#84Interfacial tilt-resistant bonded assembly and methods for forming the same
#85Circuit board and method for manufacturing electrical connection box including circuit board
#86Raised via for terminal connections on different planes
#87Device and method for reel-to-reel laser reflow
#88Coupling of integrated circuits (ICS) through a passivation-defined contact pad
#89Semiconductor package with solder standoff
#90Hybrid bonding structures and semiconductor devices including the same
#91SOLDER PRINTING
#92Compliant Electronic Component Interconnection
#93Semiconductor packages and methods of packaging semiconductor devices
#94Chip package positioning and fixing structure
#95Tiled light emitting diode display panel having different resistance per unit length signal lines
#96Batch soldering of different elements in power module
#97Printed circuit film, display device, and method of fabricating printed circuit film
#98Multi-sided cooling semiconductor package and method of manufacturing the same
#99Circuit Carrier Having an Installation Place for Electronic Components, Electronic Circuit and Production Method
#100Joint structure, semiconductor device, and method of manufacturing same
#101Semiconductor packages with an intermetallic layer
#102SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#103Power module of double-faced cooling
#104Packaged electronic device with film isolated power stack
#105Package with different types of semiconductor dies attached to a flange
#106Structures and methods for low temperature bonding using nanoparticles
#107Die-bonding method and spraying device for LED
#108Semiconductor device and method for producing semiconductor device
#109Light emitting device and fluidic manufacture thereof
#110METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PREFORM
#111DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#112Semiconductor package with solder standoff
#113Semiconductor device
#114METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOLDER THAT HAS BEEN TEMPORARILY SECURED
#115Soldering a conductor to an aluminum layer
#116Die attach methods and semiconductor devices manufactured based on such methods
#117GANG CLIP
#118Semiconductor device including binding agent adhering an integrated circuit device to an interposer
#119Quantum dot LED package and quantum dot LED module including the same
#120Packaged electronic device with film isolated power stack
#121Semiconductor package and method for fabricating a semiconductor package
#122Seal ring structures and methods of forming same
#123Bonded structure and bonding material
#124Device and method for reel-to-reel laser reflow
#125Semiconductor devices and methods of making the same
#126Semiconductor package
#127Assembly process for circuit carrier and circuit carrier
#128Electronic device module and manufacturing method thereof
#129Raised via for terminal connections on different planes
#130DIE BONDING APPARATUS AND DIE BONDING METHOD
#131Chip assembly
#132Method for fastening a semiconductor chip on a substrate, and electronic component
#133Solder material and method for die attachment
#134Semiconductor with external electrode
#135Structures and methods for low temperature bonding using nanoparticles
#136Semiconductor package and clip with a die attach
#137Conductive bonding layer with spacers between a package substrate and chip
#138Semiconductor device manufacturing method and soldering support jig
#139Semiconductor device with enhanced thermal dissipation and method for making the same
#140Electronic assemblies having a mesh bond material and methods of forming thereof
#141Semiconductor device including a solder compound containing a compound Sn/Sb
#142High reliability lead-free solder alloys for harsh environment electronics applications
#143Method of Manufacturing a Multi-Chip Semiconductor Power Device
#144Electronic device with multi-layer contact and system
#145Semiconductor device, method for manufacturing the same, and power conversion device
#146SEMICONDUCTOR DEVICE
#147Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#148Integrated circuit packages and methods of forming same
#149Semiconductor device and method
#150Power module comprising a housing which is formed in levels
#151Method for fabricating the electronic component, and method for transposing a micro-element
#152Die attach methods and semiconductor devices manufactured based on such methods
#153Patterned die pad for packaged vertical semiconductor devices
#154SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
#155LED backplane having planar bonding surfaces and method of making thereof
#156Semiconductor device and method for manufacturing the same
#157Power module and production method of the same
#158Raised via for terminal connections on different planes
#159Metal additive structures on printed circuit boards
#160Semiconductor package
#161Semiconductor systems having dual leadframes
#162Integrated circuit (IC) package with a solder receiving area and associated methods
#163Integrated circuit package with conductive clips
#164Wafer level flat no-lead semiconductor packages and methods of manufacture
#165Wafer level flat no-lead semiconductor packages and methods of manufacture
#166Wafer level flat no-lead semiconductor packages and methods of manufacture
#167Component joining apparatus, component joining method and mounted structure
#168Placement method for circuit carrier and circuit carrier
#169Process for fabricating circuit components in matrix batches
#170Light emitting device and fluidic manufacture thereof
#171Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#172Semiconductor device having high yield strength intermediate plate
#173Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
#174Clip for semiconductor package
#175Electronic package with tapered pedestal
#176Seal ring structures and methods of forming same
#177Optical package structure, optical module, and method for manufacturing the same
#178BONDING MATERIAL
#179Member for semiconductor device
#180Semiconductor device manufacturing method and soldering support jig
#181Semiconductor chip and method of processing a semiconductor chip
#182Method for assembling a carrier with components, pigment for assembling a carrier with a component and method for producing a pigment
#183DIE BONDING TO A BOARD
#184Electronic component device
#185Method for producing electronic device with multi-layer contact
#186SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#187Method for producing soldered product
#188SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
#189Dam for three-dimensional integrated circuit
#190Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#191Semiconductor device, manufacturing method for semiconductor device, and electrode plate
#192Semiconductor device
#193Package with different types of semiconductor dies attached to a flange
#194Semiconductor package
#195Electronic assembly with enhanced thermal dissipation
#196Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element
#197Semiconductor device and method of integrating power module with interposer and opposing substrates
#198Implementing reworkable strain relief packaging structure for electronic component interconnects
#199Integrated circuit (IC) package with a solder receiving area and associated methods
#200Semiconductor device and method for manufacturing semiconductor device
#201Structures and methods for low temperature bonding using nanoparticles
#202Raised via for terminal connections on different planes
#203Massively parallel transfer of microLED devices
#204Seal ring structures and methods of forming same
#205Semiconductor device and method with clip arrangement in IC package
#206Wafer level flat no-lead semiconductor packages and methods of manufacture
#207Implementing reworkable strain relief packaging structure for electronic component interconnects
#208Semiconductor devices and methods of making the same
#2093D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#210Display device including support films
#211Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#212Micro-transfer printing with volatile adhesive layer
#213Method of manufacturing semiconductor device and semiconductor device
#214Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
#215Chip assembly
#216Intelligent power module and manufacturing method thereof
#217Die attach methods and semiconductor devices manufactured based on such methods
#218Method and apparatus for making integrated circuit packages
#219System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
#220Semiconductor device
#221Semiconductor device with solders of different melting points and method of manufacturing
#222DIE BONDING APPARATUS AND DIE BONDING METHOD
#223MICROWAVE CONNECTORS FOR SEMICONDUCTOR WAFERS
#224Semiconductor packages and methods of fabrication thereof
#225Light emitting device and fluidic manufacture thereof
#226POWER CONVERSION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#227Method for producing a soldered connection
#228Method of selectively transferring LED die to a backplane using height controlled bonding structures
#229Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device
#230Method and materials for warpage thermal and interconnect solutions
#231Low temperature high reliability alloy for solder hierarchy
#232PV-MODULE AND METHOD FOR MAKING A SOLDER JOINT
#233Method for fabricating stack die package
#234Semiconductor package including a semiconductor die having redistributed pads
#235PROCESS OF FORMING SEMICONDUCTOR DEVICE
#236Method of manufacturing semiconductor device
#237Semiconductor devices and methods of making the same
#238Engineered Residue Solder Paste Technology
#239Semiconductor packages with an intermetallic layer
#240Semiconductor systems having premolded dual leadframes
#241Gallium arsenide devices with copper backside for direct die solder attach
#242Method of manufacturing element chip and method of manufacturing electronic component-mounted structure using plasma etch to singulate element chip
#2433D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#244Semiconductor devices and methods of making the same
#245Devices and methods for solder flow control in three-dimensional microstructures
#246Structures and methods for low temperature bonding using nanoparticles
#247Method for manufacturing thermal interface sheet
#248Die bonding to a board
#249Compliant micro device transfer head
#250Structures and methods for low temperature bonding using nanoparticles
#251Method of manufacturing wafer level packaging including through encapsulation vias
#252Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#253Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#254Power module packaging structure and method for manufacturing the same
#255Semiconductor device
#256Method of forming a semiconductor package
#257High reliability lead-free solder alloys for harsh environment electronics applications
#258Packaging solutions for devices and systems comprising lateral GaN power transistors
#259Power module and method of manufacturing power module
#260Semiconductor device
#261Au-based solder die attachment semiconductor device and method for manufacturing the same
#262METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
#263Electrode connection structure and electrode connection method
#264Semiconductor device
#265Method for the diffusion soldering of an electronic component to a substrate
#266Electronic component and method for manufacturing electronic component
#267Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#268Semiconductor chip and method of processing a semiconductor chip
#269Semiconductor device and method for manufacturing the same
#270Semiconductor device
#271Laser assisted transfer welding process
#272Wafer to wafer bonding process and structures
#273Wiring substrate
#274Semiconductor module
#275Electronic module and method of manufacturing the same
#276Integrated circuit (IC) package with a solder receiving area and associated methods
#277Semiconductor device and an electronic device
#278Semiconductor device and manufacturing method thereof
#279Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device
#280Semiconductor device and method of manufacturing semiconductor device
#281SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
#282Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof
#283Method of forming a chip assembly with a die attach liquid
#284Electronic devices with semiconductor die coupled to a thermally conductive substrate
#285Semiconductor device having multiple bonded heat sinks
#286Lead frame construct for lead-free solder connections
#287Semiconductor device and manufacturing method of semiconductor device
#288Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#289Semiconductor device including a semiconductor element and a fixed member to which the semiconductor element is fixed
#290Wafer level flat no-lead semiconductor packages and methods of manufacture
#291Semiconductor device with metal film and method for manufacturing semiconductor device with metal film
#292Ultra-thin power transistor and synchronous buck converter having customized footprint
#293Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure
#294Micro-pillar assisted semiconductor bonding
#295Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#296Semiconductor module
#297GaN power device with solderable back metal
#298Substrate
#299Semiconductor module
#300Method and materials for warpage thermal and interconnect solutions