211351 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Soldering or alloying Reflow soldering
Compliant micro device transfer head
#302Semiconductor module package and method of manufacturing the same
#303Semiconductor module
#304Semiconductor devices and methods of making the same
#305Hermetically sealed wafer packages
#306Power semiconductor package with conductive clips
#307Dam for three-dimensional integrated circuit
#308Integrated circuit package
#309Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#310Solder paste, joining method using the same and joined structure
#311Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
#312Electronic Device and Method for Fabricating an Electronic Device
#313Semiconductor device having multiple contact clips
#314COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#315Chip stack structure using conductive film bridge adhesive technology
#316Wafer-level die attach metallization
#317Electric component mounting method
#318Methods of stress balancing in gallium arsenide wafer processing
#319Electronic component and method for manufacturing electronic component
#320Method for mounting a chip and chip package
#321Vertical LED chip package on TSV carrier
#322Semiconductor module and method for manufacturing the same
#323Sealed semiconductor light emitting device
#324Reducing formation of oxide on solder
#325Die attachment apparatus and method utilizing activated forming gas
#326VACUUM MOLDING APPARATUS, SUBSTRATE PROCESSING SYSTEM HAVING THE SAME AND SUBSTRATE PROCESSING METHOD USING THE SAME
#327Lead frame having a perimeter recess within periphery of component terminal
#328Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig
#329METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER
#330Semiconductor device, electronic device, and semiconductor device manufacturing method
#331Power module package
#332Method of forming a semiconductor package
#333Devices and methods for solder flow control in three-dimensional microstructures
#334Small footprint semiconductor package
#335Joining method, method for producing electronic device and electronic part
#336Electronic component and method of fabricating the same
#337Escape routes
#338Semiconductor device manufacturing method
#339Power converter
#340Multi-chip semiconductor power device
#341Method for fabricating stack die package
#342Gold die bond sheet preform
#343Reflow film, solder bump formation method, solder joint formation method, and semiconductor device
#344Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
#345Solder and die-bonding structure
#346Power transistor arrangement and method for manufacturing the same
#347Joining method and semiconductor device manufacturing method
#348Electrically conductive adhesive compound and adhesive tape
#349Manufacturing process and heat dissipating device for forming interface for electronic component
#350Preform including a groove extending to an edge of the preform
#351Semiconductor device and manufacturing method thereof
#352Method for producing semiconductor device
#353Method for manufacturing a semiconductor device having multiple heat sinks
#354Low void solder joint for multiple reflow applications
#355Integrated circuit package
#356Landside stiffening capacitors to enable ultrathin and other low-Z products
#357Semiconductor packages and methods of fabrication thereof
#358Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
#359Solder, solder joint structure and method of forming solder joint structure
#360Solder fatigue arrest for wafer level package
#361Power module and method of manufacturing the power module
#362Semiconductor device and method of manufacturing same
#363Substrate structure, method of mounting semiconductor chip, and solid state relay
#364Bondable top metal contacts for gallium nitride power devices
#365Three dimensional (3D) fan-out packaging mechanisms
#366Semiconductor component support and semiconductor device
#367GaN power device with solderable back metal
#368Package-in-packages and methods of formation thereof
#369Method for manufacturing printed circuit boards
#370Semiconductor device and a method of manufacturing same
#371Lid attach process
#372Semiconductor device
#373Compliant micro device transfer head
#374SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
#375Semiconductor device package having backside contact and method for manufacturing
#376OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA
#377Methods of stress balancing in gallium arsenide wafer processing
#378MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP BONDING
#379Heterogeneous chip integration with low loss interconnection through adaptive patterning
#380Electrically bonded arrays of transfer printed active components
#381HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS
#382Circuit board component shim structure
#383Package structure and the method to manufacture thereof
#384Electronic device with multi-layer contact
#385Joining method and semiconductor device manufacturing method
#386Semiconductor device, electronic device, and semiconductor device manufacturing method
#387Manufacturing process and heat dissipating device for forming interface for electronic component
#388Flange for semiconductor die
#389Method for manufacturing wafer-bonded semiconductor device
#390BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL
#391Composite layered chip package
#392Die backside standoff structures for semiconductor devices
#393Package structure, method for manufacturing same, and method for repairing package structure
#394CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#395Hermetically sealed wafer packages
#396Method of Manufacturing a semiconductor module and device for the same
#397Layered chip package and method of manufacturing same
#398Layered chip package and method of manufacturing same
#399Power converter, semiconductor device, and method for manufacturing power converter
#400Low void solder joint for multiple reflow applications
#401Method for dispensing solder on a substrate and method for mounting semiconductor chips
#402Wafer level package with thermal pad for higher power dissipation
#403Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
#404Ultra-thin power transistor and synchronous buck converter having customized footprint
#405Method for the production of an electronic component and electronic component produced according to this method
#406SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#407Semiconductor apparatus and method for manufacturing the same
#408CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME
#409SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#410Light emitting die (LED) packages and related methods
#411Device including two semiconductor chips and manufacturing thereof
#412Method for bonding of chips on wafers
#413Method of manufacturing LED light bar and manufacturing equipment thereof
#414Vacuum wafer level packaging method for micro electro mechanical system device
#415Solder paste, joining method using the same and joined structure
#416Simultaneous wafer bonding and interconnect joining
#417Metallic thermal joint for high power density chips
#418Semiconductor device and manufacturing method thereof
#419LEAD-FREE HIGH TEMPERATURE COMPOUND
#420Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology
#421ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME
#422Laser assisted transfer welding process
#423Reducing formation of oxide on solder
#424Electronic component and electronic device
#425Incident radiation detector packaging
#426Semiconductor Package And Method For Making The Same
#427Multi-chip semiconductor packages and assembly thereof
#428Method for mounting luminescent device
#429Soldering entities to a monolithic metallic sheet
#430Semiconductor module and method for production thereof
#431Layered chip package and method of manufacturing same
#432Chip package and fabricating method thereof
#433Method for packaging semiconductor device
#434Layered chip package and method of manufacturing same
#435Layered chip package and method of manufacturing same
#436Layered chip package and method of manufacturing same
#437Laminated semiconductor substrate, laminated chip package and method of manufacturing the same
#438METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
#439Die backside standoff structures for semiconductor devices
#440Flux-free chip to wafer joint serial thermal processor arrangement
#441Vertical LED chip package on TSV carrier
#442Flip-chip mounting method and bump formation method
#443Flange for semiconductor die
#444Wiring board, manufacturing method of the wiring board, and semiconductor package
#445Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures
#446Light-emitting diode package
#447NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
#448Method of mounting LED chip
#449Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
#450SYSTEM AND METHOD FOR SOLDER BONDING
#451Self-assembled electrical contacts
#452Top-side cooled semiconductor package with stacked interconnection plates and method
#453WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES
#454Printed circuit boards
#455LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT
#456Manufacturing method of resin-sealed semiconductor device
#457LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
#458I/O pad structures for integrated circuit devices
#459Power semiconductor package
#460Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
#461INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE
#462SYSTEM AND METHOD FOR SOLDER BONDING
#463Power semiconductor module
#464METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
#465Flip-chip mounting method and bump formation method
#466Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#467Flip-chip light emitting diode device without sub-mount
#468Semiconductor package including a semiconductor die having redistributed pads
#469Semiconductor device and manufacturing method thereof
#470Power semiconductor package
#471Manufacturing method of stack-type semiconductor device
#472Semiconductor device using semiconductor chip
#473Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#474Flip-chip light emitting diode device without sub-mount
#475Method for manufacturing connection construction
#476Circuit device and manufacturing method of circuit device
#477Semiconductor device and method
#478Semiconductor package structure having hollow chamber and bottom substrate and package process thereof
#479Semiconductor devices and packaging methods thereof