ClassID:

211380

H01L2224/83899 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like; Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other using resilient parts in the layer connector or in the bonding area

Recent Application in this class: