H01L2224/8391 - CPC Classification Index

ClassID:

211391 ⎘

H01L2224/8391 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Post-treatment of the layer connector or bonding area Cleaning, e.g. oxide removal step, desmearing

Sub-classes:

H01L2224/83911 » Chemical cleaning, e.g. etching, flux 9
H01L2224/83912 » Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow 9
H01L2224/83913 » Plasma cleaning 2
H01L2224/83914 » Thermal cleaning, e.g. using laser ablation or by electrostatic corona discharge 3
H01L2224/83919 » Combinations of two or more cleaning methods provided for in at least two different groups from to 0

Recent Application in this class:

20260047490

HIGH BANDWIDTH MEMORY AND METHOD FOR MANUFACTURING THE SAME

20240387492

DISPLAY DEVICE

20180090420

Method of manufacturing semiconductor device and semiconductor device

20170162403

Method for fabricating stack die package

20160027722

Stacked synchronous buck converter having chip embedded in outside recess of leadframe

20140273344

Method for fabricating stack die package

20140252607

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

20120021174

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE