H01L2224/83909 - CPC Classification Index

ClassID:

211390 ⎘

H01L2224/83909 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Post-treatment of the layer connector or bonding area

Sub-classes:

H01L2224/8391 » Cleaning, e.g. oxide removal step, desmearing 7
H01L2224/8392 » Applying permanent coating, e.g. protective coating 31
H01L2224/8393 » Reshaping 11
H01L2224/83948 » Thermal treatments, e.g. annealing, controlled cooling 100
H01L2224/83951 » Forming additional members, e.g. for reinforcing, fillet sealant 137

Recent Application in this class:

20240371820

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

20220223497

Integrated high efficiency gate on gate cooling

20210320236

Method for transferring and bonding of devices

20200126951

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

20170250134

Methods for microelectronics fabrication and packaging using a magnetic polymer

20170250133

Systems and methods for microelectronics fabrication and packaging using a magnetic polymer

20140070393

Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

20130064967

Liquid adhesive boundary control