ClassID:

211395

H01L2224/83914 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Post-treatment of the layer connector or bonding area; Cleaning, e.g. oxide removal step, desmearing Thermal cleaning, e.g. using laser ablation or by electrostatic corona discharge

Recent Application in this class: