H01L2224/8393 - CPC Classification Index

ClassID:

211398 ⎘

H01L2224/8393 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Post-treatment of the layer connector or bonding area Reshaping

Sub-classes:

H01L2224/83931 » by chemical means, e.g. etching 19
H01L2224/83935 » by heating means, e.g. reflowing 6
H01L2224/83947 » by mechanical means, e.g. "pull-and-cut", pressing, stamping 12

Recent Application in this class:

20250391818

UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME

20230282618

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

20230282612

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

20230087367

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

20230066893

Mechanical wafer alignment detection for bonding process

20220336427

UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME

20210358883

FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS

20210202616

LED-OLED hybrid self-emissive display

20180190614

Massively parallel transfer of microLED devices

20150107765

UV-curable anisotropic conductive adhesive

20090025967

Methods of attaching a die to a substrate

20050155223

Methods of making microelectronic assemblies