211400 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Post-treatment of the layer connector or bonding area; Reshaping by heating means, e.g. reflowing
Sub-classes:SEMICONDUCTOR DEVICE WITH CONTROLLED BOND LINE THICKNESS USING SPACERS AND RECESSES
#2SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE
#3SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
#4METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
#5METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
#6Seal ring structures and methods of forming same
#7Seal ring structures and methods of forming same
#8Seal ring structures and methods of forming same
#9Seal ring structures and methods of forming same
#10Method for direct bonding of III-V semiconductor substrates with a radical oxide layer