H01L2224/84009 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector Pre-treatment of the connector and/or the bonding area

• H01L2224/8401 » Cleaning, e.g. oxide removal step, desmearing 0
• H01L2224/8402 » Applying permanent coating, e.g. in-situ coating 1
• H01L2224/8403 » Reshaping 1
• H01L2224/84048 » Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling 0
• H01L2224/84051 » Forming additional members 1

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