H01L2224/8401 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Pre-treatment of the connector and/or the bonding area Cleaning, e.g. oxide removal step, desmearing

• H01L2224/84011 » Chemical cleaning, e.g. etching, flux 4
• H01L2224/84012 » Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow 0
• H01L2224/84013 » Plasma cleaning 0
• H01L2224/84014 » Thermal cleaning, e.g. decomposition, sublimation 0
• H01L2224/84019 » Combinations of two or more cleaning methods provided for in at least two different groups from to 0