ClassID:

211431

H01L2224/84047 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Pre-treatment of the connector and/or the bonding area; Reshaping by mechanical means, e.g. severing, pressing, stamping

Recent Application in this class: