211471 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Applying energy for connecting Compression bonding
Sub-classes:METHOD FOR PRODUCING A SEMICONDUCTOR ASSEMBLY COMPRISING A SEMICONDUCTOR ELEMENT AND A SUBSTRATE
#2METHOD FOR PRODUCING A SEMICONDUCTOR ASSEMBLY COMPRISING A SEMICONDUCTOR ELEMENT AND A SUBSTRATE, AND CORRESPONDING DEVICE
#3METHOD OF FORMING A DIE PACKAGE AND DIE PACKAGE ARRANGEMENT
#4INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS
#5SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
#6Conductor strip with contact areas having cutouts
#7Semiconductor package including underfill layers